ZHCS161D April   2011  – July 2015 AMC1200

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Insulation Characteristics
      2. 7.3.2 IEC 61000-4-5 Ratings
      3. 7.3.3 IEC 60664-1 Ratings
      4. 7.3.4 Package Characteristics
      5. 7.3.5 IEC Safety Limiting Values
      6. 7.3.6 Regulatory Information
      7. 7.3.7 Isolation Amplifier
      8. 7.3.8 Analog Input
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Motor Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Isolated Voltage Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Detailed Description

7.1 Overview

The AMC1200 is a fully-differential precision isolation amplifier. The analog input signal is converted to a digital signal and then transferred across a capacitive isolation barrier. The digital modulation used in the AMC1200 together with the isolation barrier characteristics result in excellent reliability and transient immunity.

After processing the digital signal with a low-pass filter, an analog signal is provided at the outputs. The main building blocks are shown in the Functional Block Diagram section.

The SiO2-based capacitive isolation barrier supports a high level of magnetic field immunity, as described in application report, ISO72x Digital Isolator Magnetic-Field Immunity (SLLA181), available for download at www.ti.com.

7.2 Functional Block Diagram

AMC1200 AMC1200B ai_fbd_bas562.gif

7.3 Feature Description

7.3.1 Insulation Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIORM Maximum working insulation voltage 1200 VPEAK
VPR Input to output test voltage Qualification test: after Input/Output Safety Test Subgroup 2/3 VPR = VIORM × 1.2, t = 10 s, partial discharge < 5 pC 1140 VPEAK
Qualification test: method a, after environmental tests subgroup 1, VPR = VIORM × 1.6, t = 10 s, partial discharge < 5 pC 1920 VPEAK
100% production test: method b1, VPR = VIORM x 1.875,
t = 1 s, partial discharge < 5 pC		 2250 VPEAK
VIOTM Transient overvoltage Qualification test: t = 60 s AMC1200 4000 VPEAK
AMC1200B 4250 VPEAK
VISO Insulation voltage per UL Qualification test: VTEST = VISO, t = 60 s AMC1200 4000 VPEAK
AMC1200B 4250 VPEAK
100% production test: VTEST = 1.2 x VISO, t = 1 s AMC1200 4800 VPEAK
AMC1200B 5100 VPEAK
RS Insulation resistance VIO = 500 V at TS > 109 Ω
PD Pollution degree 2 °

7.3.2 IEC 61000-4-5 Ratings

PARAMETER TEST CONDITIONS VALUE UNIT
VIOSM Surge immunity 1.2-μs/50-μs voltage surge and 8-μs/20-μs current surge ±6000 V

7.3.3 IEC 60664-1 Ratings(1)

PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group II
Installation classification Rated mains voltage ≤ 150 VRMS I-IV
Rated mains voltage ≤ 300 VRMS I-IV
Rated mains voltage ≤ 400 VRMS I-III
Rated mains voltage < 600 VRMS I-III
(1) Over operating free-air temperature range (unless otherwise noted).

7.3.4 Package Characteristics(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
L(I01) Minimum air gap (clearance) Shortest terminal to terminal distance through air DWV package 8 mm
DUB package 7 mm
L(I02) Minimum external tracking
(creepage) 		Shortest terminal to terminal distance across the package surface DWV package 8 mm
DUB package 7 mm
CTI Tracking resistance
(comparative tracking index)		 DIN IEC 60112/VDE 0303 part 1 ≥ 400 V
Minimum internal gap
(internal clearance)		 Distance through the insulation 0.014 mm
RIO Isolation resistance Input to output, VIO = 500 V, all pins on each side of the barrier tied together to create a two-terminal device, TA < 85°C > 1012 Ω
Input to output, VIO = 500 V,
85°C ≤ TA < TA max		 > 1011 Ω
CIO Barrier capacitance input to output VI = 0.5 VPP at 1 MHz 1.2 pF
CI Input capacitance to ground VI = 0.5 VPP at 1 MHz 3 pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of a specific application. Take care to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator on the printed-circuit-board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal according to the measurement techniques shown in the TI Isolation Glossary. Techniques such as inserting grooves and/or ribs on the PCB are used to help increase these specifications.

7.3.5 IEC Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current θJA = 246°C/W, VIN = 5.5 V, TJ = 150°C, TA = 25°C 10 mA
TC Maximum case temperature 150 °C

The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

7.3.6 Regulatory Information

VDE/IEC UL
Certified according to VDE V 0884-10 Recognized under 1577 component recognition program
Certificate number: 40016131 File number: E181974

7.3.7 Isolation Amplifier

The AMC1200 device consists of a second order delta-sigma modulator input stage including an internal reference and clock generator. The output of the modulator and clock signal are differentially transmitted over the integrated capacitive isolation barrier that separates the high- and low-voltage domains. The received bitstream and clock signals are synchronized and processed by a third-order analog filter with a nominal gain of 8 on the low-side and presented as a differential output of the device, as shown in Functional Block Diagram section.

7.3.8 Analog Input

The analog input range is tailored to directly accommodate a voltage drop across a shunt resistor used for current sensing. However, there are two restrictions on the analog input signals, VINP and VINN. If the input voltage exceeds the range AGND – 0.5 V to AVDD + 0.5 V, the input current must be limited to 10 mA to prevent the implemented input protection diodes from damage. In addition, the linearity and the noise performance of the device are ensured only when the differential analog input voltage remains within ±250 mV.

The differential analog input of the AMC1200 and AMC1200B devices is a switched-capacitor circuit based on a second-order modulator stage that digitizes the input signal into a 1-bit output stream. These devices compare the differential input signal (VIN = VINP – VINN) against the internal reference of 2.5 V using internal capacitors that are continuously charged and discharged with a typical frequency of 10 MHz. With the S1 switches closed, CIND charges to the voltage difference across VINP and VINN. For the discharge phase, both S1 switches open first and then both S2 switches close. CIND discharges to approximately AGND + 0.8 V during this phase. Figure 31 shows the simplified equivalent input circuitry.

AMC1200 AMC1200B ai_equiv_bas542.gif Figure 31. Equivalent Input Circuit

7.4 Device Functional Modes

The AMC1200 is operational when the power supplies VDD1 and VDD2 are applied as specified in the Recommended Operating Conditions section.

The AMC1200 does not have any additional functional modes.