ZHCSN84F January   2021  – October 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
    1. 3.1 功能方框图
  5. Revision History
  6. Device Comparison
    1. 5.1 Related Products
  7. Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  ADC
        1. 6.3.1.1 MAIN Domain
          1.        18
      3. 6.3.2  CPSW3G
        1. 6.3.2.1 MAIN Domain
          1.        21
          2.        22
          3.        23
      4. 6.3.3  CPTS
        1. 6.3.3.1 MAIN Domain
          1.        26
          2.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  ECAP
        1. 6.3.5.1 MAIN Domain
          1.        33
          2.        34
          3.        35
      7. 6.3.6  Emulation and Debug
        1. 6.3.6.1 MAIN Domain
          1.        38
        2. 6.3.6.2 MCU Domain
          1.        40
      8. 6.3.7  EPWM
        1. 6.3.7.1 MAIN Domain
          1.        43
          2.        44
          3.        45
          4.        46
          5.        47
          6.        48
          7.        49
          8.        50
          9.        51
          10.        52
      9. 6.3.8  EQEP
        1. 6.3.8.1 MAIN Domain
          1.        55
          2.        56
          3.        57
      10. 6.3.9  FSI
        1. 6.3.9.1 MAIN Domain
          1.        60
          2.        61
          3.        62
          4.        63
          5.        64
          6.        65
          7.        66
          8.        67
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        70
          2.        71
        2. 6.3.10.2 MCU Domain
          1.        73
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        76
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        79
          2.        80
          3.        81
          4.        82
        2. 6.3.12.2 MCU Domain
          1.        84
          2.        85
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        88
          2.        89
      15. 6.3.14 MCSPI
        1. 6.3.14.1 MAIN Domain
          1.        92
          2.        93
          3.        94
          4.        95
          5.        96
        2. 6.3.14.2 MCU Domain
          1.        98
          2.        99
      16. 6.3.15 MDIO
        1. 6.3.15.1 MAIN Domain
          1.        102
      17. 6.3.16 MMC
        1. 6.3.16.1 MAIN Domain
          1.        105
          2.        106
      18. 6.3.17 OSPI
        1. 6.3.17.1 MAIN Domain
          1.        109
      19. 6.3.18 Power Supply
        1.       111
      20. 6.3.19 PRU_ICSSG
        1. 6.3.19.1 MAIN Domain
          1.        114
          2.        115
      21. 6.3.20 Reserved
        1.       117
      22. 6.3.21 SERDES
        1. 6.3.21.1 MAIN Domain
          1.        120
      23. 6.3.22 System and Miscellaneous
        1. 6.3.22.1 Boot Mode Configuration
          1. 6.3.22.1.1 MAIN Domain
            1.         124
        2. 6.3.22.2 Clock
          1. 6.3.22.2.1 MCU Domain
            1.         127
        3. 6.3.22.3 System
          1. 6.3.22.3.1 MAIN Domain
            1.         130
          2. 6.3.22.3.2 MCU Domain
            1.         132
        4. 6.3.22.4 VMON
          1.        134
      24. 6.3.23 TIMER
        1. 6.3.23.1 MAIN Domain
          1.        137
        2. 6.3.23.2 MCU Domain
          1.        139
      25. 6.3.24 UART
        1. 6.3.24.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.24.2 MCU Domain
          1.        150
          2.        151
      26. 6.3.25 USB
        1. 6.3.25.1 MAIN Domain
          1.        154
    4. 6.4 Pin Connectivity Requirements
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  LVCMOS Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics
      8. 7.7.8  USB2PHY Electrical Characteristics
      9. 7.7.9  SerDes PHY Electrical Characteristics
      10. 7.7.10 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Requirements
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power Supply Sequencing
          1. 7.10.2.2.1 Power-Up Sequencing
          2. 7.10.2.2.2 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
          4. 7.10.5.1.4 CPSW3G IOSETs
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 7.10.5.8.4 GPMC0 IOSETs
        9. 7.10.5.9  I2C
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Controller Mode
          2. 7.10.5.11.2 MCSPI — Peripheral Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI0 PHY Mode
            1. 7.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 7.10.5.14.1.2 OSPI0 Without Data Training
              1. 7.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 7.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 7.10.5.14.2 OSPI0 Tap Mode
            1. 7.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Arm Cortex-R5F Subsystem (R5FSS)
      3. 8.2.3 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 8.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 8.4.2.20 Dual Mode Timer (DMTIMER)
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem (USBSS)
  10. Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
    3. 9.3 Clock Routing Guidelines
      1. 9.3.1 Oscillator Routing
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALV|441
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

AM64x 是 Sitara™ 新增的工业级异构 Arm® 处理器产品系列,专为要求独特结合实时处理和通信与应用处理的电机驱动器和可编程逻辑控制器 (PLC) 等工业应用而构建。AM64x 将两个支持 TSN 技术的 Sitara 器件千兆位 PRU-ICSSG 实例与最多两个 Arm® Cortex®-A53 内核、最多四个 Cortex-R5F MCU 和一个 Cortex-M4F MCU 合并到一起。

AM64x 旨在通过高性能 R5F 内核、紧密耦合的存储器组、可配置的 SRAM 分区和进出外设的专用低延迟路径提供出色的实时性能,从而实现数据快速进出 SoC。这种确定性架构允许 AM64x 处理伺服驱动器中的严格控制环路,同时 FSI、GPMC、PWM、Δ-Σ 抽取滤波器和绝对编码器接口等外设可帮助启用这些系统中的多种不同架构。

Cortex-A53 提供了 Linux 应用所必需的强大计算元件。Linux 和实时 (RT) Linux 则通过 TI 的 Processor SDK Linux 提供,后者会每年更新为最新的长期支持 (LTS) Linux 内核、引导加载程序和 Yocto 文件系统。AM64x 通过可配置的内存分区在 Linux 应用和实时数据流之间实现隔离,从而帮助桥接 Linux 世界与现实世界。Cortex-A53 可分配到采用 Linux 的 DDR 中严格工作,而内部 SRAM 可以拆分成各种大小,供 Cortex-R5F 综合或单独使用。

AM64x 提供灵活的工业通信能力,包括用于 EtherCAT 子器件、PROFINET 器件、EtherNet/IP 适配器和 IO-Link 主站的全协议栈。PRU-ICSSG 进一步提供了千兆位和基于 TSN 技术的协议所需的能力。此外,PRU-ICSSG 还支持 SoC 中的其他接口,包括 Δ-Σ 抽取滤波器和绝对编码器接口。

可通过集成的 Cortex-M4F 及其专用外设启用功能安全特性,这些外设均可与 SoC 的其余部分隔离。AM64x 还支持安全启动。

封装信息
器件型号 封装(1) 封装尺寸(2)
AM6442 ALV(FCBGA,441) 17.2mm x 17.2mm
AM6441 ALV(FCBGA,441) 17.2mm x 17.2mm
AM6422 ALV(FCBGA,441) 17.2mm x 17.2mm
AM6421 ALV(FCBGA,441) 17.2mm x 17.2mm
AM6412 ALV(FCBGA,441) 17.2mm x 17.2mm
AM6411 ALV(FCBGA,441) 17.2mm x 17.2mm
如需了解更多信息,请参阅机械、封装和可订购信息
封装尺寸(长 x 宽)为标称值,并包括引脚(如适用)。