SPRS550F October   2009  – July 2014 AM3505 , AM3517

PRODUCTION DATA.  

  1. 1Device Summary
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Features Comparison
    2. 3.2 ZCN and ZER Package Differences
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Assignments
      1. 4.1.1 Pin Map (Top View)
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Description
      1. 4.4.1 External Memory Interfaces
      2. 4.4.2 Video Interfaces
      3. 4.4.3 Serial Communication Interfaces
      4. 4.4.4 Removable Media Interfaces
      5. 4.4.5 Test Interfaces
      6. 4.4.6 Miscellaneous
      7. 4.4.7 General-Purpose IOs
      8. 4.4.8 System and Miscellaneous Terminals
      9. 4.4.9 Power Supplies
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Characteristics
    7. 5.7  Core Voltage Decoupling
    8. 5.8  Power-up and Power-down
      1. 5.8.1 Power-up Sequence
      2. 5.8.2 Power-down Sequence
    9. 5.9  Clock Specifications
      1. 5.9.1 Oscillator
      2. 5.9.2 Input Clock Specifications
      3. 5.9.3 Output Clock Specifications
      4. 5.9.4 DPLL Specifications
        1. 5.9.4.1 Digital Phase-Locked Loop (DPLL)
          1. 5.9.4.1.1 DPLL1 (MPU)
          2. 5.9.4.1.2 DPLL3 (CORE)
          3. 5.9.4.1.3 DPLL4 (Peripherals)
          4. 5.9.4.1.4 DPLL5 (Second peripherals DPLL)
        2. 5.9.4.2 DPLL Noise Isolation
    10. 5.10 Video DAC Specifications
      1. 5.10.1 Interface Description
      2. 5.10.2 Electrical Specifications Over Recommended Operating Conditions
      3. 5.10.3 Analog Supply (vdda_dac) Noise Requirements
      4. 5.10.4 External Component Value Choice
  6. 6Timing Requirements and Switching Characteristics
    1. 6.1 Timing Test Conditions
    2. 6.2 Interface Clock Specifications
      1. 6.2.1 Interface Clock Terminology
      2. 6.2.2 Interface Clock Frequency
      3. 6.2.3 Clock Jitter Specifications
      4. 6.2.4 Clock Duty Cycle Error
    3. 6.3 Timing Parameters
    4. 6.4 External Memory Interfaces
      1. 6.4.1 General-Purpose Memory Controller (GPMC)
        1. 6.4.1.1 GPMC/NOR Flash Interface Synchronous Timing
        2. 6.4.1.2 GPMC/NOR Flash Interface Asynchronous Timing
        3. 6.4.1.3 GPMC/NAND Flash Interface Timing
      2. 6.4.2 SDRAM Controller (SDRC)
        1. 6.4.2.1 LPDDR Interface
          1. 6.4.2.1.1 LPDDR Interface Schematic
          2. 6.4.2.1.2 Compatible JEDEC LPDDR Devices
          3. 6.4.2.1.3 PCB Stackup
          4. 6.4.2.1.4 Placement
          5. 6.4.2.1.5 LPDDR Keep Out Region
          6. 6.4.2.1.6 Net Classes
          7. 6.4.2.1.7 LPDDR Signal Termination
          8. 6.4.2.1.8 LPDDR CK and ADDR_CTRL Routing
        2. 6.4.2.2 DDR2 Interface
          1. 6.4.2.2.1  DDR2 Interface Schematic
          2. 6.4.2.2.2  Compatible JEDEC DDR2 Devices
          3. 6.4.2.2.3  PCB Stackup
          4. 6.4.2.2.4  Placement
          5. 6.4.2.2.5  DDR2 Keep Out Region
          6. 6.4.2.2.6  Bulk Bypass Capacitors
          7. 6.4.2.2.7  High-Speed Bypass Capacitors
          8. 6.4.2.2.8  Net Classes
          9. 6.4.2.2.9  DDR2 Signal Termination
          10. 6.4.2.2.10 VREF Routing
          11. 6.4.2.2.11 DDR2 CLK and ADDR_CTRL Routing
          12. 6.4.2.2.12 On Die Termination (ODT)
    5. 6.5 Video Interfaces
      1. 6.5.1 Video Processing Subsystem (VPSS)
        1. 6.5.1.1 Video Processing Front End (VPFE)
          1. 6.5.1.1.1 Video Processing Front End (VPFE) Timing
      2. 6.5.2 Display Subsystem (DSS)
        1. 6.5.2.1 LCD Display Support in Bypass Mode
          1. 6.5.2.1.1 LCD Display in TFT Mode
          2. 6.5.2.1.2 LCD Display in STN Mode
    6. 6.6 Serial Communications Interfaces
      1. 6.6.1  Multichannel Buffered Serial Port (McBSP) Timing
        1. 6.6.1.1 McBSP in Normal Mode
          1. 6.6.1.1.1 McBSP1
          2. 6.6.1.1.2 McBSP2
          3. 6.6.1.1.3 McBSP3
            1. 6.6.1.1.3.1 McBSP3 Multiplexed on McBSP3 Pins
            2. 6.6.1.1.3.2 McBSP3 Multiplexed on UART2 or McBSP1 Pins
          4. 6.6.1.1.4 McBSP4
          5. 6.6.1.1.5 McBSP5
          6. 6.6.1.1.6 McBSP in TDM Mode
          7. 6.6.1.1.7 McBSP Timing Diagrams
      2. 6.6.2  Multichannel Serial Port Interface (McSPI) Timing
        1. 6.6.2.1 McSPI in Slave Mode
        2. 6.6.2.2 McSPI in Master Mode
      3. 6.6.3  Multiport Full-Speed Universal Serial Bus (USB) Interface
        1. 6.6.3.1 Multiport Full-Speed Universal Serial Bus (USB) - Unidirectional Standard 6-pin Mode
        2. 6.6.3.2 Multiport Full-Speed Universal Serial Bus (USB) - Bidirectional Standard 4-pin Mode
        3. 6.6.3.3 Multiport Full-Speed Universal Serial Bus (USB) - Bidirectional Standard 3-pin Mode
      4. 6.6.4  Multiport High-Speed Universal Serial Bus (USB) Timing
        1. 6.6.4.1 High-Speed Universal Serial Bus (USB) on Ports 1 and 2 12-bit Master Mode
      5. 6.6.5  USB0 OTG (USB2.0 OTG)
        1. 6.6.5.1 USB OTG Electrical Parameters
      6. 6.6.6  High-End Controller Area Network Controller (HECC) Timing
        1. 6.6.6.1 HECC Timing Requirements
        2. 6.6.6.2 HECC Switching Characteristics
      7. 6.6.7  Ethernet Media Access Controller (EMAC)
        1. 6.6.7.1 EMAC Electrical Data/ Timing
      8. 6.6.8  Management Data Input/Output (MDIO)
        1. 6.6.8.1 Management Data Input/Output (MDIO) Electrical Data/Timing
      9. 6.6.9  Universal Asynchronous Receiver/Transmitter (UART)
        1. 6.6.9.1 UART IrDA Interface
          1. 6.6.9.1.1 IrDA—Receive Mode
          2. 6.6.9.1.2 IrDA—Transmit Mode
      10. 6.6.10 HDQ / 1-Wire Interfaces
        1. 6.6.10.1 HDQ Protocol
        2. 6.6.10.2 1-Wire Protocol
      11. 6.6.11 I2C Interface
        1. 6.6.11.1 I2C Standard/Fast-Speed Mode
        2. 6.6.11.2 I2C High-Speed Mode
    7. 6.7 Removable Media Interfaces
      1. 6.7.1 High-Speed Multimedia Memory Card (MMC) and Secure Digital IO Card (SDIO) Timing
        1. 6.7.1.1 MMC/SD/SDIO in SD Identification Mode
        2. 6.7.1.2 MMC/SD/SDIO in High-Speed MMC Mode
        3. 6.7.1.3 MMC/SD/SDIO in Standard MMC Mode and MMC Identification Mode
        4. 6.7.1.4 MMC/SD/SDIO in High-Speed SD Mode
        5. 6.7.1.5 MMC/SD/SDIO in Standard SD Mode
    8. 6.8 Test Interfaces
      1. 6.8.1 Embedded Trace Macro Interface (ETM)
      2. 6.8.2 JTAG Interfaces
        1. 6.8.2.1 JTAG Free Running Clock Mode
        2. 6.8.2.2 JTAG Adaptive Clock Mode
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Getting Started and Next Steps
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Related Links
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Package Option Addendum

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZER|484
  • ZCN|491
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 Revision History

This data manual revision history table highlights the technical and major format changes made from Revision E to Revision F.

SEE ADDITIONS/MODIFICATIONS/DELETIONS
Description:
Added Device Information table
Section 3 Device Comparison:
Added Section 3, Device Comparison
Added Section 3.1, Device Features Comparison
Moved Section 3.2, ZCN and ZER Package Differences to Section 3, Device Comparison
Section 4 Terminal Configuration and Functions:
Changed title from Terminal Description to Terminal Configuration and Functions
Section 4.4.9 Signal Description:
Added pin N22 to VDDS row of the ZCN package in Table 4-27, Power Supplies Description.
Section 5 Specifications:
Changed title from Electrical Characteristics to Specifications
Extracted handling ratings from Table 5-1, Absolute Maximum Ratings Over Operating Junction Temperature Range and added Table 5-2, Handling Ratings
Moved Section 5.9, Clock Specifications to Section 5, Specifications
Moved Section 5.10, Video DAC Specifications toSection 5, Specifications
Section 5.4 Power Consumption Summary:
Moved Table 5-4, Estimated Power Consumption at Ball Level to its own section.
Section 5.5 Electrical Characteristics:
Changed title from DC Electrical Characteristics to Electrical Characteristics
Section 5.6 Thermal Characteristics:
Changed title from Package Thermal Resistance to Thermal Characteristics
Moved section from Package Characteristics to separate section
Added θJA, θJC, θJB values to tables (Table 5-6 and Table 5-7) for ZCN and ZER package thermal resistance characteristics.
Section 7 Device and Documentation Support
Changed title Package Characteristics to Device and Documentation Support
Changed title Device and Development Support - Support Tool Nomenclature to Section 7.1.2, Device Nomenclature
Added Section 7.1.1, Development Support
Changed title Related Documentation From Texas Instruments to Section 7.2.1, Related Documentation
Moved section Related Documentation to Section 7.2.1, Related Documentation
Section 8 Mechanical Packaging and Orderable Information
Changed title Mechanical Data to Mechanical Packaging and Orderable Information