ZHCS190D May   2011  – November 2015 ADS5263

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, Dynamic Performance - 16-Bit ADC
    6. 7.6  Electrical Characteristics, General - 16-Bit ADC Mode
    7. 7.7  Electrical Characteristics, Dynamic Performance - 14-Bit ADC
    8. 7.8  Digital Characteristics
    9. 7.9  Timing Requirements
    10. 7.10 LVDS Timing at Lower Sampling Frequencies - 2 Wire, 8× Serialization
    11. 7.11 LVDS Timing for 1 Wire 16× Serialization
    12. 7.12 LVDS Timing for 2 Wire, 7× Serialization
    13. 7.13 LVDS Timing for 1 Wire, 14× Serialization
    14. 7.14 Serial Interface Timing Requirements
    15. 7.15 Reset Switching Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 Typical Characteristic - 16-Bit ADC Mode
      2. 7.16.2 Typical Characteristic - 14-Bit ADC Mode
      3. 7.16.3 Typical Characteristics - Common Plots
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Processing Blocks
      2. 8.3.2 Digital Gain
      3. 8.3.3 Digital Filter
      4. 8.3.4 Custom Filter Coefficients
        1. 8.3.4.1 Custom Filter Without Decimation
      5. 8.3.5 Digital Averaging
      6. 8.3.6 Performance with Digital Processing Blocks
        1. 8.3.6.1 18-Bit Data Output with Digital Processing
      7. 8.3.7 Flexible Mapping o Channel Data to LVDS Outputs
      8. 8.3.8 Output LVDS Interface
      9. 8.3.9 Programmable LCLK Phase
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
      2. 8.4.2 Serial Register Readout
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Register Initialization
    6. 8.6 Register Maps
      1. 8.6.1 Default State After Reset
      2. 8.6.2 Description of Serial Registers
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Analog Input
        1. 9.1.1.1 Drive Circuit Requirements
      2. 9.1.2 Large and Small Signal Input Bandwidth
      3. 9.1.3 Clamp Function For CCD Signals
        1. 9.1.3.1 Differential Input Drive
        2. 9.1.3.2 Clamp Operation
        3. 9.1.3.3 Synchronization to External CCD Timing
      4. 9.1.4 Low-Frequency Noise Suppression
      5. 9.1.5 External Reference Mode
    2. 9.2 Typical Applications
      1. 9.2.1 Driving Circuit Design: Low Input Frequencies (< 50 MHz)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Driving Circuit Design: Input Frequencies > 50 MHz
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 技术规范定义
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息
    1. 13.1 封装
      1. 13.1.1 外露焊盘
      2. 13.1.2 非磁性封装

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems.

  1. Use wide and short traces for the main current path and for the power ground tracks without using vias if possible. If vias are unavoidable, use many vias in parallel to reduce resistance and inductance.
  2. At each power-supply pin (AVDD, DVDD, or AVDDD3V), keep a 0.1-µF de-coupling capacitor close to the device. A separate de-coupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source.
  3. Use of a ground plane is recommended.
  4. Keep digital outputs away from the analog inputs. When these digital outputs exit the pinout, the digital output traces must not be kept parallel to the analog input traces because this configuration can result in coupling from the digital outputs to the analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] must be matched in length to avoid skew among outputs.

Since ADS5263 provides charging current and system power with internal linear regulators, users need to consider thermal condition.

  1. PowerPAD should be soldered to a thermal land on the PCB.
  2. Vias on the thermal land of the PCB are necessary. This is a thermal path through the other side of the PCB.
  3. A thermal pad of the same size is required on the other side of the PCB. All thermal pads should be connected by vias.
  4. A metal layer should cover all of the PCB if possible.
  5. Place vias to connect other sides to create thermal paths.

With these steps, the thermal resistance of ADS5263 can be lowered.

11.2 Layout Example

ADS5263 ADS5263_example_Layout.jpg Figure 105. Layout of Board