ZHCSFU8B May 2016 – December 2021 ADC32RF80 , ADC32RF83
PRODUCTION DATA
| THERMAL METRIC(1) | ADC32RF80 | UNIT | ||
|---|---|---|---|---|
| RMP (VQFN) |
RHH (VQFN) |
|||
| 72 PINS |
72 PINS |
|||
| RθJA | Junction-to-ambient thermal resistance | 21.8 |
17.7 |
°C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 4.4 |
4.9 |
°C/W |
| RθJB | Junction-to-board thermal resistance | 2.0 |
4.1 |
°C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 |
0.1 |
°C/W |
| ψJB | Junction-to-board characterization parameter | 2.0 |
3.9 |
°C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.2 |
0.2 |
°C/W |