ZHCSHO8A February 2018 – April 2020 ADC08DJ3200
PRODUCTION DATA.
Figure 168 to Figure 170 provide examples of the critical traces routed on the device evaluation module (EVM).
Figure 168. Top Layer Routing: Analog Inputs, CLK and SYSREF, DA0-3, DB0-3
Figure 169. GND1 Cutouts to Optimize Impedance of Component Pads
Figure 170. Bottom Layer Routing: Additional CLK Routing, DA4-7, DB4-7