SLVU356A January   2010  – October 2021 TPS54290 , TPS54291

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Description
    2. 1.2 Applications
    3. 1.3 Features
  3. 2TPS54291EVM-431 Electrical Performance Specifications
  4. 3Schematic
    1. 3.1 Enable Jumpers (JP1 and JP2)
    2. 3.2 Error Amplifier Outputs
    3. 3.3 Test Point Descriptions
      1. 3.3.1 Input Voltage Monitoring (TP1 and TP2)
      2. 3.3.2 Channel 1 Output Voltage Monitoring (TP3 and TP4)
      3. 3.3.3 Channel 1 Loop Analysis (TP5, TP6, TP7, and TP8)
      4. 3.3.4 Channel 1 Switching Waveforms (TP9 and TP10)
      5. 3.3.5 TPS54291 IC Ground (TP11)
      6. 3.3.6 Channel 2 Switching Waveforms (TP12 and TP13)
      7. 3.3.7 Channel 2 Loop Analysis (TP14, TP15, TP16, and TP17)
      8. 3.3.8 Output Voltage Monitoring (TP18 and TP19)
  5. 4Test Setup
    1. 4.1 Equipment
      1. 4.1.1 Voltage Source (VIN)
      2. 4.1.2 Meters
      3. 4.1.3 Loads
      4. 4.1.4 Oscilloscope
      5. 4.1.5 Recommended Wire Gauge
      6. 4.1.6 Other
    2. 4.2 Equipment Setup
      1. 4.2.1 Procedure
      2. 4.2.2 Diagram
    3. 4.3 Start-Up/Shutdown Procedure
    4. 4.4 Output Ripple Voltage Measurement Procedure
    5. 4.5 Control Loop Gain and Phase Measurement Procedure
    6. 4.6 Equipment Shutdown
  6. 5TPS54291EVM-431 Typical Performance Data and Characteristic Curves
    1. 5.1 Efficiency
    2. 5.2 Line and Load Regulation
    3. 5.3 Switch Node and Output Ripple Voltage
  7. 6EVM Assembly Drawings and Layout
  8. 7List of Materials
  9. 8Revision History

6 EVM Assembly Drawings and Layout

Figure 6-1 through Figure 6-6 show the designs of the TPS54291EVM-431 printed circuit board. The EVM has been designed using a 4-layer, 2-oz copper-clad circuit board 3.0 inch × 3.0 inch with all components in a 0.86-inch × 1.28-inch active area on the top side and all active traces to the top and bottom layers to allow the user to easily view, probe, and evaluate the TPS54291 control IC in a practical double-sided application. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space constrained systems.

GUID-613042EE-01E3-4C65-9893-58BE02011ED6-low.gifFigure 6-1 TPS54291EVM-431 Component Placement (Viewed from Top)
GUID-D82938ED-F995-467E-9556-3FAD80E3AE3E-low.gifFigure 6-2 TPS54291EVM-431 Silkscreen (Viewed from Top)
GUID-478A7DF7-5680-4C4F-BB7B-8166B93FC650-low.gifFigure 6-3 TPS54291EVM-431 Top Copper (Viewed from Top)
GUID-D6F0792E-1040-4833-AFB1-6DD2951BDCD5-low.gifFigure 6-4 TPS54291EVM-431 Bottom Copper (X-Ray View from Top)
GUID-A6B0C0C4-9FCE-4899-97B1-DC13F4FFB9D7-low.gifFigure 6-5 TPS54291EVM-431 Internal 1 (X-Ray View from Top)
GUID-A456372F-56E1-49B5-8176-4B46172BD67E-low.gifFigure 6-6 TPS54291EVM-431 Internal 2 (X-Ray View from Top)