SFFS728 October   2023 OPA2333-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC Package
    2. 2.2 VSSOP Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC Package
    2. 4.2 VSSOP Package

1 Overview

This document contains information for OPA2333-Q1 (SOIC and VSSOP packages) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-FD9F895D-DBF0-4E43-8DCF-F79DE12CE660-low.gifFigure 1-1 Functional Block Diagram

OPA2333-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.