SFFS231B August   2021  – July 2022 TLV3601-Q1 , TLV3602-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DCK, DBV, DGK, DSG Packages
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DCK and DBV Package
  6. 5Revision History

2.1 DCK, DBV, DGK, DSG Packages

This section provides Functional Safety Failure In Time (FIT) rates for the DCK and DBV packages of TLV3601-Q1 and DGK and DSG packages of TLV3602-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 TLV3601-Q1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 DCK FIT (Failures Per 109 Hours) DBV FIT (Failures Per 109 Hours)
Total Component FIT Rate

3

 4
Die FIT Rate 2 2
Package FIT Rate

1

 2
Table 2-2 TLV3602-Q1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 DGK FIT (Failures Per 109 Hours) DBV FIT (Failures Per 109 Hours)
Total Component FIT Rate

7

 4
Die FIT Rate 3 2
Package FIT Rate

4

 2

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • TLV3601-Q1 Power dissipation: 19.8 mW
  • TLV3602-Q1 Power dissipation: 39.6 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-3 TLV3601-Q1, TLV3602-Q1 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ

4

CMOS, BICMOS
Digital, analog / mixed		12 FIT55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.