ZHCSAO4F December   2012  – March 2018 UCC27611

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Enable Function
      5. 7.3.5 Output Stage
      6. 7.3.6 Low Propagation Delays
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Gate Drive Supply Voltage
        2. 8.2.2.2 Input Configuration
        3. 8.2.2.3 Output Configuration
        4. 8.2.2.4 Power Dissipation
        5. 8.2.2.5 Thermal Considerations
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Design Requirements

The requirements of gate-driver for driving enhancement mode GaN FET are listed as below:

  • The headroom between the recommended gate-drive voltage and the absolute maximum rating of GaN transistor is generally marginal. It is critical to drive the GaN FET by an accurate gate-drive supply voltage
  • The turnon threshold of the GaN transistor is generally much lower than that of silicon MOSFETs, the risk of Miller turnon and shoot-through becomes a concern for the higher-voltage devices. Low pulldown impedance is necessary to boost the immunity of Miller turnon
  • With enhancement mode GaN transistors, the need for minimizing pulldown impedance means that addition pulldown gate resistor and antiparallel diode connection is not recommended. Split the gate pullup and pulldown connections and allow the insertion of external pullup resistance for EMI and voltage-overshoot control is needed
  • At high switching speeds, the impact of the gate-drive interconnection impedance becomes important, low-inductance packages with good thermal capability is required for gate driver