ZHCSF18E May   2016  – May 2019 TUSB1002

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, Power Supply
    6. 6.6  Electrical Characteristics
    7. 6.7  Power-Up Requirements
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Control Inputs
      2. 7.3.2 Linear Equalization
      3. 7.3.3 Adjustable VOD Linear Range and DC Gain
      4. 7.3.4 Receiver Detect Control
      5. 7.3.5 USB3.1 Dual Channel Operation (MODE = “F”)
      6. 7.3.6 USB3.1 Single Channel Operation (MODE = “1”)
      7. 7.3.7 PCIe/SATA/SATA Express Redriver Operation (MODE = “R”; CFG1 = "0"; CFG2 = "0" )
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Disconnect Mode
    5. 7.5 U0 Mode
    6. 7.6 U1 Mode
    7. 7.7 U2/U3 Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical USB3.1 Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Typical SATA, PCIe and SATA Express Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (October 2017) to E Revision

  • 从特性、说明 和器件信息 中删除了 TUSB1002I 工业Go
  • Deleted TUSB1002I Operating free-air temperature from the Recommended Operating ConditionsGo
  • Deleted TUSB1002I from the Thermal Information tableGo

Changes from C Revision (August 2017) to D Revision

  • Changed pin 8 From: RXIN To: RX1N in the RGE pin imageGo

Changes from B Revision (August 2017) to C Revision

  • 在特性中将“14 种线性均衡设置，在速率为 10Gbps 时最高为 15dB”更改成了“16 种线性均衡设置，在速率为 10Gbps 时最高为 16 dB”Go
  • Deleted the RMQ package option from the Pin Configuration and Functions section Go
  • Deleted the RMQ package from the Pin Functions table Go
  • Changed the description of pin 7 From: R = Test Mode To: R = PCIe / Test Mode. in the Pin Functions table Go
  • Deleted the RMQ column from Thermal Information table Go
  • Added Differential crosstalk between TX and RX signal pairs. Go
  • From: EQ(GAIN-10Gbps) 15dB To: EQ(GAIN-10Gbps) 16dBGo
  • EQ setting 15 changed from Reserved to 10.4 / 16.0 Go
  • EQ setting 16 changed from Reserved to 10.6 / 16.3 Go
  • Added the PCIe/SATA/SATA Express Redriver Operation section. Go
  • Added the Typical SATA, PCIe, and SATA Expess Application section Go

Changes from A Revision (May 2016) to B Revision

  • 向简化原理图的 RXP2 和 RXN2 引脚添加了一个电容器Go
  • Added a capacitor to the RXP2 and RXN2 pins of Figure 17Go
  • Updated the A/C coupling Capacitor section of Table 4Go
  • Changed text in the Detailed Design Procedure From: No A/C coupling capacitors are placed on the RX2P/N. To: 330nF A/C coupling capacitors along with 220k resistors are placed on the RX2P and RX2N. Inclusion of these 330nF capacitors and 220k resistors is optional but highly recommended. If not implemented, then RX2P/N should be DC-coupled to the USB receptacle.Go
  • Added 330nF AC capacitors (C12 and C13) on RX2P and RX2N in Figure 18Go

Changes from * Revision (May 2016) to A Revision

  • 已将器件状态由“产品预览”改为“量产数据”Go