ZHCSPA2A July   2023  – December 2023 TPSM828301 , TPSM828302 , TPSM828303

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information Module
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse Width Modulation (PWM) Operation
      2. 7.3.2 Power Save Mode (PSM) Operation
      3. 7.3.3 Start-Up and Soft Start
      4. 7.3.4 Switch Cycle-by-Cycle Current Limit
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Optimized EMI Performance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Disable, and Output Discharge
      2. 7.4.2 Minimum Duty Cycle and 100% Mode Operation
      3. 7.4.3 Power Good
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting The Output Voltage
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.2.1 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component.

Two basic approaches for enhancing thermal performance are:

  • Improving the power dissipation capability of the PCB design
  • Introducing airflow in the system

The Thermal Data section in Thermal Information Module provides the thermal metric of the device on the EVM after considering the PCB design of real applications. The big copper planes connecting to the pads of the IC on the PCB improve the thermal performance of the device. For more details on how to use the thermal parameters, see the Thermal Characteristics application notes, Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.