ZHCSE51
September 2015
TPS657095
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
修订历史记录
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
State Diagram
7.3.2
Power-up Timing
7.3.3
GPO
7.3.4
GPIO
7.3.5
LED_EN
7.3.6
Minimum-On-Time Feature
7.3.7
PWM Dimming
7.3.8
Crystal Oscillator and CLKOUT
7.3.9
LDOs
7.3.10
Undervoltage Lockout
7.3.11
Power Up/Power Down Default States
7.3.12
Output Voltage Discharge for LDO1 and LDO2
7.3.13
Power-Good Status Bits for LDO1 and LDO2
7.3.14
Short-Circuit Protection
7.3.15
Thermal Shutdown
7.3.16
LED Driver
7.3.17
4kByte OTP Memory
7.3.17.1
Programming the 4KByte OTP Memory
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Operational Mode
7.5
Programming
7.5.1
Serial Interface
7.6
Register Map
7.6.1
DEV_AND_REV_ID Register Address: 00h
7.6.2
OTP_REV Register Address: 01h
7.6.3
GPIO_CTRL Register Address: 02h
7.6.4
PWM_OSC_CNTRL Register Address: 03h
7.6.5
ISINK_CURRENT Register Address: 04h
7.6.6
LDO_CTRL Register Address: 05h
7.6.7
LDO1_VCTRL Register Address: 06h
7.6.8
LDO2_VCTRL Register Address: 07h
7.6.9
PWM_DUTY_THR_L Register Address: 08h
7.6.10
PWM_DUTY_THR_H Register Address: 09h
7.6.11
MIN_ON_TIME_THR Register Address: 0Ah
7.6.12
PWM_DUTY_L Register Address: 0Bh
7.6.13
PWM_DUTY_H Register Address: 0Ch
7.6.14
MIN_ON_TIME Register Address: 0Dh
7.6.15
SPARE Register Address: 0Eh
7.6.16
4K_OTP_PASSWORD Register Address: 0Fh
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Output Capacitor Selection
8.2.2.2
Input Capacitor Selection
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
Third-Party Products Disclaimer
11.2
社区资源
11.3
商标
11.4
静电放电警告
11.5
Glossary
12
机械、封装和可订购信息
12.1
封装概要
12.2
芯片尺寸封装尺寸
封装选项
机械数据 (封装 | 引脚)
YFF|16
MXBG096W
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcse51_oa
4 修订历史记录
日期
修订版本
注释
2015 年 9 月
*
首次发布。