ZHCSE51 September   2015 TPS657095

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  State Diagram
      2. 7.3.2  Power-up Timing
      3. 7.3.3  GPO
      4. 7.3.4  GPIO
      5. 7.3.5  LED_EN
      6. 7.3.6  Minimum-On-Time Feature
      7. 7.3.7  PWM Dimming
      8. 7.3.8  Crystal Oscillator and CLKOUT
      9. 7.3.9  LDOs
      10. 7.3.10 Undervoltage Lockout
      11. 7.3.11 Power Up/Power Down Default States
      12. 7.3.12 Output Voltage Discharge for LDO1 and LDO2
      13. 7.3.13 Power-Good Status Bits for LDO1 and LDO2
      14. 7.3.14 Short-Circuit Protection
      15. 7.3.15 Thermal Shutdown
      16. 7.3.16 LED Driver
      17. 7.3.17 4kByte OTP Memory
        1. 7.3.17.1 Programming the 4KByte OTP Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Operational Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Map
      1. 7.6.1  DEV_AND_REV_ID Register Address: 00h
      2. 7.6.2  OTP_REV Register Address: 01h
      3. 7.6.3  GPIO_CTRL Register Address: 02h
      4. 7.6.4  PWM_OSC_CNTRL Register Address: 03h
      5. 7.6.5  ISINK_CURRENT Register Address: 04h
      6. 7.6.6  LDO_CTRL Register Address: 05h
      7. 7.6.7  LDO1_VCTRL Register Address: 06h
      8. 7.6.8  LDO2_VCTRL Register Address: 07h
      9. 7.6.9  PWM_DUTY_THR_L Register Address: 08h
      10. 7.6.10 PWM_DUTY_THR_H Register Address: 09h
      11. 7.6.11 MIN_ON_TIME_THR Register Address: 0Ah
      12. 7.6.12 PWM_DUTY_L Register Address: 0Bh
      13. 7.6.13 PWM_DUTY_H Register Address: 0Ch
      14. 7.6.14 MIN_ON_TIME Register Address: 0Dh
      15. 7.6.15 SPARE Register Address: 0Eh
      16. 7.6.16 4K_OTP_PASSWORD Register Address: 0Fh
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 封装概要
    2. 12.2 芯片尺寸封装尺寸

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Layout

10.1 Layout Guidelines

● The VCC and AVCC terminals should be bypassed to gorund with a low ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 1uF with a X5R or X7R dielectric.

● The optimum placement is closest to the AVCC terminal and the AGND terminal.

● The AGND and GND terminals should be tied to the pcb ground plane at the terminal of the IC

10.2 Layout Example

TPS657095 PCB_Layout.gif