ZHCSJH2E November   2007  – April 2019 TPS61165

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft Start-Up
      2. 8.3.2 Open LED Protection
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Maximum Output Current
      2. 9.1.2 Inductor Selection
      3. 9.1.3 Schottky Diode Selection
      4. 9.1.4 Compensation Capacitor Selection
      5. 9.1.5 Input and Output Capacitor Selection
    2. 9.2 Typical Applications
      1. 9.2.1 TPS61165 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 LED Brightness Dimming Mode Selection
          2. 9.2.1.2.2 PWM Brightness Dimming
          3. 9.2.1.2.3 Digital One-Wire Brightness Dimming
          4. 9.2.1.2.4 EasyScale: One-Wire Digital Dimming
          5. 9.2.1.2.5 Current Program
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Additional Application Circuits
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Thermal Information

THERMAL METRIC(1)(2) TPS61165 UNIT
DRV (WSON) DBV (SOT-23)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 80.7 210.1 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 55.4 46.8 °C/W
RθJB Junction-to-board thermal resistance 140.2 56.7 °C/W
ψJT Junction-to-top characterization parameter 0.3 0.5 °C/W
ψJB Junction-to-board characterization parameter 36.5 50.2 °C/W
RθJC(bottom) Junction-to-case(bottom) thermal resistance 0.9 — °C/W
(1) 有关传统和新热指标的更多信息，请参见应用报告《半导体和 IC 封装热指标》（文献编号：SPRA953）。
(2) 有关该器件的基于 PCB 覆铜区的热评估信息，请参阅 TI PCB 热应力计算。