ZHCSCU1 September   2014 TPS53632

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics (2-Phase Operation)
    9. 6.9 Typical Characteristics (3-Phase Operation)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Sensing
      2. 7.3.2  Load Transients
      3. 7.3.3  AutoBalance Current Sharing
      4. 7.3.4  PWM and SKIP Signals
      5. 7.3.5  5-V, 3.3-V and 1.8-V Undervoltage Lockout (UVLO)
      6. 7.3.6  Output Undervoltage Protection (UVP)
      7. 7.3.7  Overcurrent Protection (OCP)
      8. 7.3.8  Overvoltage Protection
      9. 7.3.9  Analog Current Monitor, IMON and Corresponding Digital Output Current
      10. 7.3.10 Addressing
      11. 7.3.11 I2C Interface Operation
        1. 7.3.11.1 Key for Protocol Examples
        2. 7.3.11.2 Protocol Examples
      12. 7.3.12 Start-Up Sequence
      13. 7.3.13 Phase Add and Drop Operation
      14. 7.3.14 Power Good Operation
      15. 7.3.15 Input Voltage Limits
      16. 7.3.16 Fault Behavior
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
    5. 7.5 Configuration and Programming
      1. 7.5.1 Operating Frequency
      2. 7.5.2 Overcurrent Protection (OCP) Level
      3. 7.5.3 IMON Gain
      4. 7.5.4 Slew Rate
      5. 7.5.5 Base Address
      6. 7.5.6 Ramp Selection
      7. 7.5.7 Active Phases
    6. 7.6 Register Maps
      1. 7.6.1 Voltage Select Register (VSR) (00h)
      2. 7.6.2 IMON Register (03h)
      3. 7.6.3 VMAX Register (04h)
      4. 7.6.4 Power State Register (06h)
      5. 7.6.5 SLEW Register (07h)
      6. 7.6.6 Lot Code Registers (10-13h)
      7. 7.6.7 Fault Register (14h)
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 3-Phase D-CAP+™, Step-Down Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Step 1: Select Switching Frequency
          2. 8.2.1.2.2 Step 2: Set The Slew Rate
          3. 8.2.1.2.3 Step 3: Determine Inductor Value And Choose Inductor
          4. 8.2.1.2.4 Step 4: Determine Current Sensing Method
          5. 8.2.1.2.5 Step 5: DCR Current Sensing
          6. 8.2.1.2.6 Step 6: Select OCP Level
          7. 8.2.1.2.7 Step 7: Set the Load-Line Slope
          8. 8.2.1.2.8 Step 8: Current Monitor (IMON) Setting
        3. 8.2.1.3 Application Performance Plots
        4. 8.2.1.4 Loop Compensation for Zero Load-Line
  9. Power Supply Recommendations
  10. 10 Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout
      2. 10.1.2 Current Sensing Lines
      3. 10.1.3 Feedback Voltage Sensing Lines
      4. 10.1.4 PWM And SKIP Lines
        1. 10.1.4.1 Minimize High Current Loops
      5. 10.1.5 Power Chain Symmetry
      6. 10.1.6 Component Location
      7. 10.1.7 Grounding Recommendations
      8. 10.1.8 Decoupling Recommendations
      9. 10.1.9 Conductor Widths
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 商标

Excel is a registered trademark of Microsoft Corporation.

针对快速瞬态响应提供 D-CAP+, AutoBalance are trademarks of TI.

All other trademarks are the property of their respective owners.

11.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

11.3 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。