ZHCSCU1 September   2014 TPS53632

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics (2-Phase Operation)
    9. 6.9 Typical Characteristics (3-Phase Operation)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Sensing
      2. 7.3.2  Load Transients
      3. 7.3.3  AutoBalance Current Sharing
      4. 7.3.4  PWM and SKIP Signals
      5. 7.3.5  5-V, 3.3-V and 1.8-V Undervoltage Lockout (UVLO)
      6. 7.3.6  Output Undervoltage Protection (UVP)
      7. 7.3.7  Overcurrent Protection (OCP)
      8. 7.3.8  Overvoltage Protection
      9. 7.3.9  Analog Current Monitor, IMON and Corresponding Digital Output Current
      10. 7.3.10 Addressing
      11. 7.3.11 I2C Interface Operation
        1. 7.3.11.1 Key for Protocol Examples
        2. 7.3.11.2 Protocol Examples
      12. 7.3.12 Start-Up Sequence
      13. 7.3.13 Phase Add and Drop Operation
      14. 7.3.14 Power Good Operation
      15. 7.3.15 Input Voltage Limits
      16. 7.3.16 Fault Behavior
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
    5. 7.5 Configuration and Programming
      1. 7.5.1 Operating Frequency
      2. 7.5.2 Overcurrent Protection (OCP) Level
      3. 7.5.3 IMON Gain
      4. 7.5.4 Slew Rate
      5. 7.5.5 Base Address
      6. 7.5.6 Ramp Selection
      7. 7.5.7 Active Phases
    6. 7.6 Register Maps
      1. 7.6.1 Voltage Select Register (VSR) (00h)
      2. 7.6.2 IMON Register (03h)
      3. 7.6.3 VMAX Register (04h)
      4. 7.6.4 Power State Register (06h)
      5. 7.6.5 SLEW Register (07h)
      6. 7.6.6 Lot Code Registers (10-13h)
      7. 7.6.7 Fault Register (14h)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 3-Phase D-CAP+™, Step-Down Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Step 1: Select Switching Frequency
          2. 8.2.1.2.2 Step 2: Set The Slew Rate
          3. 8.2.1.2.3 Step 3: Determine Inductor Value And Choose Inductor
          4. 8.2.1.2.4 Step 4: Determine Current Sensing Method
          5. 8.2.1.2.5 Step 5: DCR Current Sensing
          6. 8.2.1.2.6 Step 6: Select OCP Level
          7. 8.2.1.2.7 Step 7: Set the Load-Line Slope
          8. 8.2.1.2.8 Step 8: Current Monitor (IMON) Setting
        3. 8.2.1.3 Application Performance Plots
        4. 8.2.1.4 Loop Compensation for Zero Load-Line
  9. 9 Power Supply Recommendations
  10. 10 Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout
      2. 10.1.2 Current Sensing Lines
      3. 10.1.3 Feedback Voltage Sensing Lines
      4. 10.1.4 PWM And SKIP Lines
        1. 10.1.4.1 Minimize High Current Loops
      5. 10.1.5 Power Chain Symmetry
      6. 10.1.6 Component Location
      7. 10.1.7 Grounding Recommendations
      8. 10.1.8 Decoupling Recommendations
      9. 10.1.9 Conductor Widths
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Power Supply Recommendations

This device is designed to operate from a supply voltage at the V5A pin (5-V power input for analog circuits) from 4.5 V to 5.5 V and a supply voltage at the VDD pin (3.3-V digital power input) from 3.1 V to 3.5 V, and a supply voltage at the VINTF pin from 1.7 V to 3.5 V. Use only a well-regulated supply. The VIN pin input must be connected to the conversion input voltage and must not exceed 28 V. Proper bypassing of the V5A and VDD input supplies is critical for noise performance, as is PCB layout and grounding scheme. See the recommendations in the Layout section.