ZHCSB59E April   2011  – December 2015 TPS22924B , TPS22924C

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, VIN = 3.6 V
    7. 7.7  Switching Characteristics, VIN = 0.9 V
    8. 7.8  Typical Characteristics
    9. 7.9  AC Characteristics (TPS22924B)
    10. 7.10 AC Characteristics (TPS22924C)
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON/OFF Control
      2. 9.3.2 Output Capacitor
      3. 9.3.3 Output Pulldown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 VIN to VOUT Voltage Drop
      2. 10.1.2 Input Capacitor
      3. 10.1.3 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Managing Inrush Current
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 相关链接
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Device Comparison Table

TA PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) BACKSIDE COATING (3) RISE TIME AT VIN = 3.3V (TYP.)
–40°C to 85°C YZ (0.4mm height) TPS22924BYZR _ _ _ 5N _ No 96µs
–40°C to 85°C YZP (0.5mm height) TPS22924BYZPRB _ _ _ 5N _ Yes 96µs
–40°C to 85°C YZZ (0.35mm height) TPS22924BYZZR _ _ _ 7A _ No 96µs
–40°C to 85°C YZP (0.5mm height) TPS22924CYZPR _ _ _ 5L _ No 800µs
–40°C to 85°C YZP (0.4mm height) TPS22924CYZPRB _ _ _ 5L _ Yes 800µs
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
(3) CSP (DSBGA) devices manufactured with backside coating have an increased resistance to cracking due to the increased physical strength of the package. Devices with backside coating are highly encouraged for new designs.