SLVSA44B November   2009  – February 2015 TPS22907

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VIN = 3.6 V
    7. 6.7  Switching Characteristics: VIN = 1.8 V
    8. 6.8  Switching Characteristics: VIN = 1.1 V
    9. 6.9  Typical DC Characteristics
    10. 6.10 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor
      2. 9.1.2 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Managing Inrush Current
        2. 9.2.2.2 Voltage Drop from VIN to VOUT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage –0.3 4 V
VOUT Output voltage –0.3 (VIN + 0.3) V
VON Input voltage –0.3 4 V
IMAX Maximum continuous switch current 1 A
IPLS Maximum pulsed current (100-µs pulse, 2% duty cycle), TA = –40°C to +85°C 2.7 A
TJ Maximum junction temperature 125 °C
TLEAD Maximum lead temperature (10-s soldering time) 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VIN Input voltage range 1.1 3.6 V
VOUT Output voltage range VIN V
VIH High-level input voltage, ON 0.85 3.6 V
VIL Low-level input voltage, ON 0.4 V
CIN Input capacitor 1(1) μF
TA Operating free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1)(2) TPS22907 UNIT
YZT (DSBGA)
4 PINS
RθJA Junction-to-ambient thermal resistance 189.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 1.9
RθJB Junction-to-board thermal resistance 37.2
ΨJT Junction-to-top characterization parameter 10.2
ΨJB Junction-to-board characterization parameter 37
RθJC(bot) Junction-to-case(bottom) thermal resistance —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

6.5 Electrical Characteristics

Unless otherwise noted, the specification applies over the operating ambient temperature -40°C ≤ TA ≤ 85°C and VIN = 1.1 V to 3.6 V. Typical values are for VIN = 3.6 V and TA = 25°C.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
IQ Quiescent current IOUT = 0 mA, VIN = VON Full 0.07 1 µA
ISD Off supply current VON = 0 V, OUT = Open Full 0.05 1 µA
IIN(LEAKAGE) Leakage current VON = 0 V, VOUT = 0 V Full 0.05 1 µA
RON ON-state resistance VIN = 3.6 V, IOUT = –200 mA 25°C 44 60 mΩ
Full 67
VIN = 2.5 V, IOUT = –200 mA 25°C 50 63
Full 70
VIN = 1.8 V, IOUT = –200 mA 25°C 58 72
Full 80
VIN = 1.2 V, IOUT = –200 mA 25°C 83 106
Full 117
VIN = 1.1 V, IOUT = –200 mA 25°C 97 125
Full 140
ION ON input leakage current VON = 0 V to 3.6 V Full 0.005 1 µA

6.6 Switching Characteristics: VIN = 3.6 V

TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL = 500 Ω, CL = 0.1 μF 28 μs
tOFF Turn-OFF time RL = 500 Ω, CL = 0.1 μF 40 μs
tr VOUT rise time RL = 500 Ω, CL = 0.1 μF 25 μs
tf VOUT fall time RL = 500 Ω, CL = 0.1 μF 116 μs

6.7 Switching Characteristics: VIN = 1.8 V

TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL = 500 Ω, CL = 0.1 μF 48 μs
tOFF Turn-OFF time RL = 500 Ω, CL = 0.1 μF 40 μs
tr VOUT rise time RL = 500 Ω, CL = 0.1 μF 36 μs
tf VOUT fall time RL = 500 Ω, CL = 0.1 μF 113 μs

6.8 Switching Characteristics: VIN = 1.1 V

TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL = 500 Ω, CL = 0.1 μF 81 μs
tOFF Turn-OFF time RL = 500 Ω, CL = 0.1 μF 42 μs
tr VOUT rise time RL = 500 Ω, CL = 0.1 μF 57 μs
tf VOUT fall time RL = 500 Ω, CL = 0.1 μF 113 μs

6.9 Typical DC Characteristics

TPS22907 g_ron_vin_lvsa44.gif
Figure 1. ON-State Resistance vs. Input Voltage
TPS22907 g_iin_vin_lvsa44.gif
Figure 3. VIN Quiescent Current vs. Input Voltage
TPS22907 g_iinoff_vin_lvsa44.gif
Figure 5. VIN Off Supply Current vs. Input Voltage
TPS22907 g_iinleak_vin_lvsa44.gif
Figure 7. VIN Leakage Current vs. Input Voltage
TPS22907 g_on_in_thresh_lvsa44.gif
Figure 9. ON Input Threshold
TPS22907 g_ron_temp_lvsa44.gif
Figure 2. ON-State Resistance vs. Temperature
TPS22907 g_iin_temp_lvsa44.gif
Figure 4. VIN Quiescent Current vs. Temperature
TPS22907 g_iinoff_temp_lvsa44.gif
Figure 6. VIN OFF Supply Current vs. Temperature
TPS22907 g_iinleak_temp_lvsa44.gif
Figure 8. VIN Leakage Current vs. Temperature

6.10 Typical AC Characteristics

TPS22907 g_toff_temp_lvsa44.gif
Figure 10. OFF Time vs. Temperature
TPS22907 g_trise_temp_lvsa44.gif
Figure 12. Rise Time vs. Temperature
TPS22907 ton_resp_vin3p6_cl0p1_lvsa44.gif
Figure 14. tON Response
TPS22907 ton_resp_vin1p1_cl0p1_lvsa44.gif
Figure 16. tON Response
TPS22907 ton_resp_vin3p6_cl10_lvsa44.gif
Figure 18. tON Response
TPS22907 ton_resp_vin1p1_cl10_lvsa44.gif
Figure 20. tON Response
TPS22907 g_ton_temp_lvsa44.gif
Figure 11. ON Time vs. Temperature
TPS22907 g_tfall_temp_lvsa44.gif
Figure 13. Fall Time vs. Temperature
TPS22907 toff_resp_vin3p6_cl0p1_lvsa44.gif
Figure 15. tOFF Response
TPS22907 toff_resp_vin1p1_cl0p1_lvsa44.gif
Figure 17. tOFF Response
TPS22907 toff_resp_vin3p6_cl10_lvsa44.gif
Figure 19. tOFF Response
TPS22907 toff_resp_vin1p1_cl10_lvsa44.gif
Figure 21. tOFF Response