SLVSA44B November   2009  – February 2015 TPS22907

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VIN = 3.6 V
    7. 6.7  Switching Characteristics: VIN = 1.8 V
    8. 6.8  Switching Characteristics: VIN = 1.1 V
    9. 6.9  Typical DC Characteristics
    10. 6.10 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor
      2. 9.1.2 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Managing Inrush Current
        2. 9.2.2.2 Voltage Drop from VIN to VOUT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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订购信息

4 Revision History

Changes from A Revision (September 2013) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from * Revision (November 2009) to A Revision

  • Changed Feature from: Ultra-Low ON-State Resistance to: Ultra-Low ON-State Resistance (RON)Go
  • Changed the Feature for the Wafer-Chip-Scale PackageGo
  • Changed Application from: Point Of Sales Terminal to: Point of Sale TerminalGo
  • Changed Application from: Smartphones to: Smartphones / TabletsGo
  • Deleted the Ordering Information tableGo
  • Changed the IIN Test Condition from: IOUT = 0 to IOUT = 0 mAGo
  • Changed the IIN(OFF) Test Condition from: VON = GND to VON = 0 VGo
  • Changed the IIN(LEAKAGE) Test Condition from: VON = GND, VOUT = 0 to VON = 0 V, VOUT = 0 VGo
  • Changed Table 1, Device Feature ListGo