SPNS253A May   2018  – September 2019 TMS570LC4357-EP

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Terminal Configuration and Functions
    1. 3.1 GWT BGA Package Ball-Map (337 Terminal Grid Array)
    2. 3.2 Terminal Functions
      1. 3.2.1 GWT Package
        1. 3.2.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 3.2.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 3.2.1.3  RAM Trace Port (RTP)
        4. 3.2.1.4  Enhanced Capture Modules (eCAP)
        5. 3.2.1.5  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        6. 3.2.1.6  Enhanced Pulse-Width Modulator Modules (ePWM)
        7. 3.2.1.7  Data Modification Module (DMM)
        8. 3.2.1.8  General-Purpose Input / Output (GIO)
        9. 3.2.1.9  FlexRay Interface Controller (FlexRay)
        10. 3.2.1.10 Controller Area Network Controllers (DCAN)
        11. 3.2.1.11 Local Interconnect Network Interface Module (LIN)
        12. 3.2.1.12 Standard Serial Communication Interface (SCI)
        13. 3.2.1.13 Inter-Integrated Circuit Interface Module (I2C)
        14. 3.2.1.14 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        15. 3.2.1.15 Ethernet Controller
        16. 3.2.1.16 External Memory Interface (EMIF)
        17. 3.2.1.17 Embedded Trace Macrocell Interface for Cortex-R5F (ETM-R5)
        18. 3.2.1.18 System Module Interface
        19. 3.2.1.19 Clock Inputs and Outputs
        20. 3.2.1.20 Test and Debug Modules Interface
        21. 3.2.1.21 Flash Supply and Test Pads
        22. 3.2.1.22 Supply for Core Logic: 1.2-V Nominal
        23. 3.2.1.23 Supply for I/O Cells: 3.3-V Nominal
        24. 3.2.1.24 Ground Reference for All Supplies Except VCCAD
        25. 3.2.1.25 Other Supplies
      2. 3.2.2 Multiplexing
        1. 3.2.2.1 Output Multiplexing
          1. 3.2.2.1.1 Notes on Output Multiplexing
        2. 3.2.2.2 Input Multiplexing
          1. 3.2.2.2.1 Notes on Input Multiplexing
          2. 3.2.2.2.2 General Rules for Multiplexing Control Registers
  4. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Power-On Hours (POH)
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Switching Characteristics Over Recommended Operating Conditions for Clock Domains
    6. 4.6  Wait States Required - L2 Memories
    7. 4.7  Power Consumption Summary
    8. 4.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 4.9  Thermal Resistance Characteristics for the BGA Package (GWT)
    10. 4.10 Timing and Switching Characteristics
      1. 4.10.1 Input Timings
      2. 4.10.2 Output Timings
  5. System Information and Electrical Specifications
    1. 5.1  Device Power Domains
    2. 5.2  Voltage Monitor Characteristics
      1. 5.2.1 Important Considerations
      2. 5.2.2 Voltage Monitor Operation
      3. 5.2.3 Supply Filtering
    3. 5.3  Power Sequencing and Power-On Reset
      1. 5.3.1 Power-Up Sequence
      2. 5.3.2 Power-Down Sequence
      3. 5.3.3 Power-On Reset: nPORRST
        1. 5.3.3.1 nPORRST Electrical and Timing Requirements
    4. 5.4  Warm Reset (nRST)
      1. 5.4.1 Causes of Warm Reset
      2. 5.4.2 nRST Timing Requirements
    5. 5.5  ARM Cortex-R5F CPU Information
      1. 5.5.1 Summary of ARM Cortex-R5F CPU Features
      2. 5.5.2 Dual Core Implementation
      3. 5.5.3 Duplicate Clock Tree After GCLK
      4. 5.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety
        1. 5.5.4.1 Signal Compare Operating Modes
          1. 5.5.4.1.1 Active Compare Lockstep Mode
          2. 5.5.4.1.2 Self-Test Mode
          3. 5.5.4.1.3 Error Forcing Mode
          4. 5.5.4.1.4 Self-Test Error Forcing Mode
        2. 5.5.4.2 Bus Inactivity Monitor
        3. 5.5.4.3 CPU Registers Initialization
      5. 5.5.5 CPU Self-Test
        1. 5.5.5.1 Application Sequence for CPU Self-Test
        2. 5.5.5.2 CPU Self-Test Clock Configuration
        3. 5.5.5.3 CPU Self-Test Coverage
      6. 5.5.6 N2HET STC / LBIST Self-Test Coverage
    6. 5.6  Clocks
      1. 5.6.1 Clock Sources
        1. 5.6.1.1 Main Oscillator
          1. 5.6.1.1.1 Timing Requirements for Main Oscillator
        2. 5.6.1.2 Low-Power Oscillator
          1. 5.6.1.2.1 Features
          2. 5.6.1.2.2 LPO Electrical and Timing Specifications
        3. 5.6.1.3 Phase-Locked Loop (PLL) Clock Modules
          1. 5.6.1.3.1 Block Diagram
          2. 5.6.1.3.2 PLL Timing Specifications
        4. 5.6.1.4 External Clock Inputs
      2. 5.6.2 Clock Domains
        1. 5.6.2.1 Clock Domain Descriptions
        2. 5.6.2.2 Mapping of Clock Domains to Device Modules
      3. 5.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      4. 5.6.4 Clock Test Mode
    7. 5.7  Clock Monitoring
      1. 5.7.1 Clock Monitor Timings
      2. 5.7.2 External Clock (ECLK) Output Functionality
      3. 5.7.3 Dual Clock Comparators
        1. 5.7.3.1 Features
        2. 5.7.3.2 Mapping of DCC Clock Source Inputs
    8. 5.8  Glitch Filters
    9. 5.9  Device Memory Map
      1. 5.9.1 Memory Map Diagram
      2. 5.9.2 Memory Map Table
      3. 5.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 5.9.4 Master/Slave Access Privileges
        1. 5.9.4.1 Special Notes on Accesses to Certain Slaves
      5. 5.9.5 MasterID to PCRx
      6. 5.9.6 CPU Interconnect Subsystem SDC MMR Port
      7. 5.9.7 Parameter Overlay Module (POM) Considerations
    10. 5.10 Flash Memory
      1. 5.10.1 Flash Memory Configuration
      2. 5.10.2 Main Features of Flash Module
      3. 5.10.3 ECC Protection for Flash Accesses
      4. 5.10.4 Flash Access Speeds
      5. 5.10.5 Flash Program and Erase Timings
        1. 5.10.5.1 Flash Program and Erase Timings for Program Flash
        2. 5.10.5.2 Flash Program and Erase Timings for Data Flash
    11. 5.11 L2RAMW (Level 2 RAM Interface Module)
      1. 5.11.1 L2 SRAM Initialization
    12. 5.12 ECC / Parity Protection for Accesses to Peripheral RAMs
    13. 5.13 On-Chip SRAM Initialization and Testing
      1. 5.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 5.13.1.1 Features
        2. 5.13.1.2 PBIST RAM Groups
      2. 5.13.2 On-Chip SRAM Auto Initialization
    14. 5.14 External Memory Interface (EMIF)
      1. 5.14.1 Features
      2. 5.14.2 Electrical and Timing Specifications
        1. 5.14.2.1 Read Timing (Asynchronous RAM)
        2. 5.14.2.2 Write Timing (Asynchronous RAM)
        3. 5.14.2.3 EMIF Asynchronous Memory Timing
        4. 5.14.2.4 Read Timing (Synchronous RAM)
        5. 5.14.2.5 Write Timing (Synchronous RAM)
        6. 5.14.2.6 EMIF Synchronous Memory Timing
    15. 5.15 Vectored Interrupt Manager
      1. 5.15.1 VIM Features
      2. 5.15.2 Interrupt Generation
      3. 5.15.3 Interrupt Request Assignments
    16. 5.16 ECC Error Event Monitoring and Profiling
      1. 5.16.1 EPC Module Operation
        1. 5.16.1.1 Correctable Error Handling
        2. 5.16.1.2 Uncorrectable Error Handling
    17. 5.17 DMA Controller
      1. 5.17.1 DMA Features
      2. 5.17.2 DMA Transfer Port Assignment
      3. 5.17.3 Default DMA Request Map
      4. 5.17.4 Using a GIO terminal as a DMA Request Input
    18. 5.18 Real-Time Interrupt Module
      1. 5.18.1 Features
      2. 5.18.2 Block Diagrams
      3. 5.18.3 Clock Source Options
      4. 5.18.4 Network Time Synchronization Inputs
    19. 5.19 Error Signaling Module
      1. 5.19.1 ESM Features
      2. 5.19.2 ESM Channel Assignments
    20. 5.20 Reset / Abort / Error Sources
    21. 5.21 Digital Windowed Watchdog
    22. 5.22 Debug Subsystem
      1. 5.22.1  Block Diagram
      2. 5.22.2  Debug Components Memory Map
      3. 5.22.3  Embedded Cross Trigger
      4. 5.22.4  JTAG Identification Code
      5. 5.22.5  Debug ROM
      6. 5.22.6  JTAG Scan Interface Timings
      7. 5.22.7  Advanced JTAG Security Module
      8. 5.22.8  Embedded Trace Macrocell (ETM-R5)
        1. 5.22.8.1 ETM TRACECLKIN Selection
        2. 5.22.8.2 Timing Specifications
      9. 5.22.9  RAM Trace Port (RTP)
        1. 5.22.9.1 RTP Features
        2. 5.22.9.2 Timing Specifications
      10. 5.22.10 Data Modification Module (DMM)
        1. 5.22.10.1 DMM Features
        2. 5.22.10.2 Timing Specifications
      11. 5.22.11 Boundary Scan Chain
  6. Peripheral Information and Electrical Specifications
    1. 6.1  Enhanced Translator PWM Modules (ePWM)
      1. 6.1.1 ePWM Clocking and Reset
      2. 6.1.2 Synchronization of ePWMx Time-Base Counters
      3. 6.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 6.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 6.1.5 ePWM Synchronization with External Devices
      6. 6.1.6 ePWM Trip Zones
        1. 6.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 6.1.6.2 Trip Zone TZ4n
        3. 6.1.6.3 Trip Zone TZ5n
        4. 6.1.6.4 Trip Zone TZ6n
      7. 6.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 6.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing
    2. 6.2  Enhanced Capture Modules (eCAP)
      1. 6.2.1 Clock Enable Control for eCAPx Modules
      2. 6.2.2 PWM Output Capability of eCAPx
      3. 6.2.3 Input Connection to eCAPx Modules
      4. 6.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing
    3. 6.3  Enhanced Quadrature Encoder (eQEP)
      1. 6.3.1 Clock Enable Control for eQEPx Modules
      2. 6.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 6.3.3 Input Connection to eQEPx Modules
      4. 6.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 6.4  12-bit Multibuffered Analog-to-Digital Converter (MibADC)
      1. 6.4.1 MibADC Features
      2. 6.4.2 Event Trigger Options
        1. 6.4.2.1 MibADC1 Event Trigger Hookup
        2. 6.4.2.2 MibADC2 Event Trigger Hookup
        3. 6.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 6.4.3 ADC Electrical and Timing Specifications
      4. 6.4.4 Performance (Accuracy) Specifications
        1. 6.4.4.1 MibADC Nonlinearity Errors
        2. 6.4.4.2 MibADC Total Error
    5. 6.5  General-Purpose Input/Output
      1. 6.5.1 Features
    6. 6.6  Enhanced High-End Timer (N2HET)
      1. 6.6.1 Features
      2. 6.6.2 N2HET RAM Organization
      3. 6.6.3 Input Timing Specifications
      4. 6.6.4 N2HET1-N2HET2 Interconnections
      5. 6.6.5 N2HET Checking
        1. 6.6.5.1 Internal Monitoring
        2. 6.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 6.6.6 Disabling N2HET Outputs
      7. 6.6.7 High-End Timer Transfer Unit (HET-TU)
        1. 6.6.7.1 Features
        2. 6.6.7.2 Trigger Connections
    7. 6.7  FlexRay Interface
      1. 6.7.1 Features
      2. 6.7.2 Electrical and Timing Specifications
      3. 6.7.3 FlexRay Transfer Unit
    8. 6.8  Controller Area Network (DCAN)
      1. 6.8.1 Features
      2. 6.8.2 Electrical and Timing Specifications
    9. 6.9  Local Interconnect Network Interface (LIN)
      1. 6.9.1 LIN Features
    10. 6.10 Serial Communication Interface (SCI)
      1. 6.10.1 Features
    11. 6.11 Inter-Integrated Circuit (I2C)
      1. 6.11.1 Features
      2. 6.11.2 I2C I/O Timing Specifications
    12. 6.12 Multibuffered / Standard Serial Peripheral Interface
      1. 6.12.1 Features
      2. 6.12.2 MibSPI Transmit and Receive RAM Organization
      3. 6.12.3 MibSPI Transmit Trigger Events
        1. 6.12.3.1 MIBSPI1 Event Trigger Hookup
        2. 6.12.3.2 MIBSPI2 Event Trigger Hookup
        3. 6.12.3.3 MIBSPI3 Event Trigger Hookup
        4. 6.12.3.4 MIBSPI4 Event Trigger Hookup
        5. 6.12.3.5 MIBSPI5 Event Trigger Hookup
      4. 6.12.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 6.12.5 SPI Slave Mode I/O Timings
    13. 6.13 Ethernet Media Access Controller
      1. 6.13.1 Ethernet MII Electrical and Timing Specifications
      2. 6.13.2 Ethernet RMII Electrical and Timing Specifications
      3. 6.13.3 Management Data Input/Output (MDIO)
  7. Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device and Development-Support Tool Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation from Texas Instruments
      2. 8.2.2 Receiving Notification of Documentation Updates
      3. 8.2.3 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
    6. 8.6 Device Identification
      1. 8.6.1 Device Identification Code Register
        1. Table 8-1 Device ID Bit Allocation Register Field Descriptions
      2. 8.6.2 Die Identification Registers
    7. 8.7 Module Certifications
      1. 8.7.1 FlexRay Certifications
      2. 8.7.2 DCAN Certification
      3. 8.7.3 LIN Certification
        1. 8.7.3.1 LIN Master Mode
        2. 8.7.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 8.7.3.3 LIN Slave Mode - Adaptive Baud Rate
  9. Mechanical Data
    1. 9.1 Packaging Information
  10. 10Package Option Addendum
    1. 10.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Output Multiplexing

Table 3-28 Output Multiplexing

Address
Offset
337
GWT
BALL
DEFAULT FUNCTION Select
Bit
Alternate Function 1 Select
Bit
Alternate Function 2 Select
Bit
Alternate Function 3 Select
Bit
Alternate Function 4 Select
Bit
Alternate Function 5 Select
Bit
0x110 N19 AD1EVT 0[0] MII_RX_ER 0[2] RMII_RX_ER 0[3] nTZ1_1 0[5]
D4 EMIF_ADDR[0] 0[8] N2HET2[1] 0[10]
D5 EMIF_ADDR[1] 0[16] N2HET2[3] 0[18]
C4 EMIF_ADDR[6] 0[24] RTP_DATA[13] 0[25] N2HET2[11] 0[26]
0x114 C5 EMIF_ADDR[7] 1[0] RTP_DATA[12] 1[1] N2HET2[13] 1[2]
C6 EMIF_ADDR[8] 1[8] RTP_DATA[11] 1[9] N2HET2[15] 1[10]
C7 EMIF_ADDR[9] 1[16] RTP_DATA[10] 1[17]
C8 EMIF_ADDR[10] 1[24] RTP_DATA[9] 1[25]
0x118 C9 EMIF_ADDR[11] 2[0] RTP_DATA[8] 2[1]
C10 EMIF_ADDR[12] 2[8] RTP_DATA[6] 2[9]
C11 EMIF_ADDR[13] 2[16] RTP_DATA[5] 2[17]
C12 EMIF_ADDR[14] 2[24] RTP_DATA[4] 2[25]
0x11C C13 EMIF_ADDR[15] 3[0] RTP_DATA[3] 3[1]
D14 EMIF_ADDR[16] 3[8] RTP_DATA[2] 3[9]
C14 EMIF_ADDR[17] 3[16] RTP_DATA[1] 3[17]
D15 EMIF_ADDR[18] 3[24] RTP_DATA[0] 3[25]
0x120 C15 EMIF_ADDR[19] 4[0] RTP_nENA 4[1]
C16 EMIF_ADDR[20] 4[8] RTP_nSYNC 4[9]
C17 EMIF_ADDR[21] 4[16] RTP_CLK 4[17]
0x124
-
0x12C
Reserved
0x130 PINMMR8[23:0] are reserved
D16 EMIF_BA[1] 8[24] 8[25] N2HET2[5] 8[26]
0x134 K3 RESERVED 9[0] EMIF_CLK 9[1] ECLK2 9[2]
R4 EMIF_nCAS 9[8] GIOB[3] 9[10]
N17 EMIF_nCS[0] 9[16] RTP_DATA[15] 9[17] N2HET2[7] 9[18]
L17 EMIF_nCS[2] 9[24] GIOB[4] 9[26]
0x138 K17 EMIF_nCS[3] 10[0] RTP_DATA[14] 10[1] N2HET2[9] 10[2]
M17 EMIF_nCSl[4] 10[8] RTP_DATA[7] 10[9] GIOB[5] 10[10]
R3 EMIF_nRAS 10[16] GIOB[6] 10[18]
P3 EMIF_nWAIT 10[24] GIOB[7] 10[26]
0x13C D17 EMIF_nWE 11[0] EMIF_RNW 11[1]
E9 ETMDATA[8] 11[8] EMIF_ADDR[5] 11[9]
E8 ETMDATA[9] 11[16] EMIF_ADDR[4] 11[17]
E7 ETMDATA[10] 11[24] EMIF_ADDR[3] 11[25]
0x140 E6 ETMDATA[11] 12[0] EMIF_ADDR[2] 12[1]
E13 ETMDATA[12] 12[8] EMIF_BA[0] 12[9]
E12 ETMDATA[13] 12[16] EMIF_nOE 12[17]
E11 ETMDATA[14] 12[24] EMIF_nDQM[1] 12[25]
0x144 E10 ETMDATA[15] 13[0] EMIF_nDQM[0] 13[1]
K15 ETMDATA[16] 13[8] EMIF_DATA[0] 13[9]
L15 ETMDATA[17] 13[16] EMIF_DATA[1] 13[17]
M15 ETMDATA[18] 13[24] EMIF_DATA[2] 13[25]
0x148 N15 ETMDATA[19] 14[0] EMIF_DATA[3] 14[1]
E5 ETMDATA[20] 14[8] EMIF_DATA[4] 14[9]
F5 ETMDATA[21] 14[16] EMIF_DATA[5] 14[17]
G5 ETMDATA[22] 14[24] EMIF_DATA[6] 14[25]
0x14C K5 ETMDATA[23] 15[0] EMIF_DATA[7] 15[1]
L5 ETMDATA[24] 15[8] EMIF_DATA[8] 15[9] N2HET2[24] 15[10] MIBSPI5NCS[4] 15[11]
M5 ETMDATA[25] 15[16] EMIF_DATA[9] 15[17] N2HET2[25] 15[18] MIBSPI5NCS[5] 15[19]
N5 ETMDATA[26] 15[24] EMIF_DATA[10] 15[25] N2HET2[26] 15[26]
0x150 P5 ETMDATA[27] 16[0] EMIF_DATA[11] 16[1] N2HET2[27] 16[2]
R5 ETMDATA[28] 16[8] EMIF_DATA[12] 16[9] N2HET2[28] 16[10] GIOA[0] 16[11]
R6 ETMDATA[29] 16[16] EMIF_DATA[13] 16[17] N2HET2[29] 16[18] GIOA[1] 16[19]
R7 ETMDATA[30] 16[24] EMIF_DATA[14] 16[25] N2HET2[30] 16[26] GIOA[3] 16[27]
0x154 R8 ETMDATA[31] 17[0] EMIF_DATA[15] 17[1] N2HET2[31] 17[2] GIOA[4] 17[3]
R9 ETMTRACECLKIN 17[8] EXTCLKIN2 17[9] GIOA[5] 17[11]
R10 ETMTRACECLKOUT 17[16] GIOA[6] 17[19]
R11 ETMTRACECTL 17[24] GIOA[7] 17[27]
0x158 B15 FRAYTX1 18[0] GIOA[2] 18[3]
B8 FRAYTX2 18[8] GIOB[0] 18[11]
B16 FRAYTXEN1 18[16] GIOB[1] 18[19]
B9 FRAYTXEN2 18[24] GIOB[2] 18[27]
0x15C C1 GIOA[2] 19[0] N2HET2[0] 19[2] eQEP2I 19[5]
E1 GIOA[3] 19[8] N2HET2[2] 19[10]
B5 GIOA[5] 19[16] EXTCLKIN1 19[19] ePWM1A 19[21]
H3 GIOA[6] 19[24] N2HET2[4] 19[26] ePWM1B 19[29]
0x160 M1 GIOA[7] 20[0] N2HET2[6] 20[2] ePWM2A 20[5]
F2 GIOB[2] 20[8] DCAN4TX 20[11]
W10 GIOB[3] 20[16] DCAN4RX 20[19]
J2 GIOB[6] 20[24] nERROR 20[25]
0x164 F1 GIOB[7] 21[0] RESERVED 21[1] nTZ1_2 21[5]
R2 MIBSPI1NCS[0] 21[8] MIBSPI1SOMI[1] 21[9] MII_TXD[2] 21[10] ECAP6 21[13]
F3 MIBSPI1NCS[1] 21[16] MII_COL 21[18] N2HET1[17] 21[19] eQEP1S 21[21]
G3 MIBSPI1NCS[2] 21[24] MDIO 21[26] N2HET1[19] 21[27]
0x168 J3 MIBSPI1NCS[3] 22[0] N2HET1[21] 22[3] nTZ1_3 22[5]
G19 MIBSPI1NENA 22[8] MII_RXD[2] 22[10] N2HET1[23] 22[11] ECAP4 22[13]
V9 MIBSPI3CLK 22[16] AD1EXT_SEL[1] 22[17] eQEP1A 22[21]
V10 MIBSPI3NCS[0] 22[24] AD2EVT 22[25] eQEP1I 22[29]
0x16C V5 MIBSPI3NCS[1] 23[0] MDCLK 23[2] N2HET1[25] 23[3]
B2 MIBSPI3NCS[2] 23[8] I2C1_SDA 23[9] N2HET1[27] 23[11] nTZ1_2 23[13]
C3 MIBSPI3NCS[3] 23[16] I2C1_SCL 23[17] N2HET1[29] 23[19] nTZ1_1 23[21]
W9 MIBSPI3NENA 23[24] MIBSPI3NCS[5] 23[25] N2HET1[31] 23[27] eQEP1B 23[29]
0x170 W8 MIBSPI3SIMO 24[0] AD1EXT_SEL[0] 24[1] ECAP3 24[5]
V8 MIBSPI3SOMI 24[8] AD1EXT_ENA 24[9] ECAP2 24[13]
H19 MIBSPI5CLK 24[16] DMM_DATA[4] 24[17] MII_TXEN 24[18] RMII_TXEN 24[19]
E19 MIBSPI5NCS[0] 24[24] DMM_DATA[5] 24[25] ePWM4A 24[29]
0x174 B6 MIBSPI5NCS[1] 25[0] DMM_DATA[6] 25[1]
W6 MIBSPI5NCS[2] 25[8] DMM_DATA[2] 25[9]
T12 MIBSPI5NCS[3] 25[16] DMM_DATA[3] 25[17]
H18 MIBSPI5NENA 25[24] DMM_DATA[7] 25[25] MII_RXD[3] 25[26] ECAP5 25[29]
0x178 J19 MIBSPI5SIMO[0] 26[0] DMM_DATA[8] 26[1] MII_TXD[1] 26[2] RMII_TXD[1] 26[3]
E16 MIBSPI5SIMO[1] 26[8] DMM_DATA[9] 26[9] AD1EXT_SEL[0] 26[12]
H17 MIBSPI5SIMO[2] 26[16] DMM_DATA[10] 26[17] AD1EXT_SEL[1] 26[20]
G17 MIBSPI5SIMO[3] 26[24] DMM_DATA[11] 26[25] I2C2_SDA 26[26] AD1EXT_SEL[2] 26[28]
0x17C J18 MIBSPI5SOMI[0] 27[0] DMM_DATA[12] 27[1] MII_TXD[0] 27[2] RMII_TXD[0] 27[3]
E17 MIBSPI5SOMI[1] 27[8] DMM_DATA[13] 27[9] AD1EXT_SEL[3] 27[12]
H16 MIBSPI5SOMI[2] 27[16] DMM_DATA[14] 27[17] AD1EXT_SEL[4] 27[20]
G16 MIBSPI5SOMI[3] 27[24] DMM_DATA[15] 27[25] I2C2_SCL 27[26] AD1EXT_ENA 27[28]
0x180 K18 N2HET1[0] 28[0] MIBSPI4CLK 28[1] ePWM2B 28[5]
V2 N2HET1[1] 28[8] MIBSPI4NENA 28[9] N2HET2[8] 28[11] eQEP2A 28[13]
W5 N2HET1[2] 28[16] MIBSPI4SIMO 28[17] ePWM3A 28[21]
U1 N2HET1[3] 28[24] MIBSPI4NCS[0] 28[25] N2HET2[10] 28[27] eQEP2B 28[29]
0x184 B12 N2HET1[4] 29[0] MIBSPI4NCS[1] 29[1] ePWM4B 29[5]
V6 N2HET1[5] 29[8] MIBSPI4SOMI 29[9] N2HET2[12] 29[11] ePWM3B 29[13]
W3 N2HET1[6] 29[16] SCI3RX 29[17] ePWM5A 29[21]
T1 N2HET1[7] 29[24] MIBSPI4NCS[2] 29[25] N2HET2[14] 29[27] ePWM7B 29[29]
0x188 E18 N2HET1[8] 30[0] MIBSPI1SIMO[1] 30[1] MII_TXD[3] 30[2]
V7 N2HET1[9] 30[8] MIBSPI4NCS[3] 30[9] N2HET2[16] 30[11] ePWM7A 30[13]
D19 N2HET1[10] 30[16] MIBSPI4NCS[4] 30[17] MII_TX_CLK 30[18] RESERVED 30[19] nTZ1_3 30[21]
E3 N2HET1[11] 30[24] MIBSPI3NCS[4] 30[25] N2HET2[18] 30[27] ePWM1SYNCO 30[29]
0x18C B4 N2HET1[12] 31[0] MIBSPI4NCS[5] 31[1] MII_CRS 31[2] RMII_CRS_DV 31[3]
N2 N2HET1[13] 31[8] SCI3TX 31[9] N2HET2[20] 31[11] ePWM5B 31[13]
N1 N2HET1[15] 31[16] MIBSPI1NCS[4] 31[17] N2HET2[22] 31[19] ECAP1 31[21]
A4 N2HET1[16] 31[24] ePWM1SYNCI 31[27] ePWM1SYNCO 31[29]
0x190 A13 N2HET1[17] 32[0] EMIF_nOE 32[1] SCI4RX 32[2]
J1 N2HET1[18] 32[8] EMIF_RNW 32[9] ePWM6A 32[13]
B13 N2HET1[19] 32[16] EMIF_nDQM[0] 32[17] SCI4TX 32[18]
P2 N2HET1[20] 32[24] EMIF_nDQM[1] 32[25] ePWM6B 32[29]
0x194 H4 N2HET1[21] 33[0] EMIF_nDQM[2] 33[1]
B3 N2HET1[22] 33[8] EMIF_nDQM[3] 33[9]
J4 N2HET1[23] 33[16] EMIF_BA[0] 33[17]
P1 N2HET1[24] 33[24] MIBSPI1NCS[5] 33[25] MII_RXD[0] 33[26] RMII_RXD[0] 33[27]
0x198 A14 N2HET1[26] 34[0] MII_RXD[1] 34[2] RMII_RXD[1] 34[3]
K19 N2HET1[28] 34[8] MII_RXCLK 34[10] RMII_REFCLK 34[11] RESERVED 34[12]
B11 N2HET1[30] 34[16] MII_RX_DV 34[18] eQEP2S 34[21]
D8 N2HET2[1] 34[24] N2HET1_NDIS 34[25]
0x19C D7 N2HET2[2] 35[0] N2HET2_NDIS 35[1]
D3 N2HET2[12] 35[8] MIBSPI2NENA 35[12] MIBSPI2NCS[1] 35[13]
D2 N2HET2[13] 35[16] MIBSPI2SOMI 35[20]
D1 N2HET2[14] 35[24] MIBSPI2SIMO 35[28]
0x1A0 P4 N2HET2[19] 36[0] LIN2RX 36[1]
T5 N2HET2[20] 36[8] LIN2TX 36[9]
T4 MII_RXCLK 36[16] RESERVED 36[20]
U7 MII_TX_CLK 36[24] RESERVED 36[28]
0x1A4 E2 N2HET2[3] 37[0] MIBSPI2CLK 37[4]
N3 N2HET2[7] 37[8] MIBSPI2NCS[0] 37[12]