ZHCSQ68A May   2022  – December 2022 TLIN1431-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Supply Characteristics
    7. 6.7 Electrical Characteristics
    8. 6.8 AC Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuit: Diagrams and Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  LIN (Local Interconnect Network) Bus
        1. 8.3.1.1 LIN Transmitter Characteristics
        2. 8.3.1.2 LIN Receiver Characteristics
          1. 8.3.1.2.1 Termination
      2. 8.3.2  TXD (Transmit Input and Output)
      3. 8.3.3  RXD (Receive Output)
      4. 8.3.4  WAKE (High Voltage Local Wake Up Input)
      5. 8.3.5  WDT or CLK (Pin Programmable Watchdog Delay Input or SPI Clock)
      6. 8.3.6  WDI or SDI (Watchdog Timer Input or SPI Serial Data In)
      7. 8.3.7  PIN or nCS (Pin Watchdog Select or SPI Chip Select)
      8. 8.3.8  LIMP (Limp Home Output – High Voltage Open Drain Output)
        1. 8.3.8.1 LIMP in Pin Control Mode
        2. 8.3.8.2 LIMP in SPI Control Mode
      9. 8.3.9  nWDR/SDO (Watchdog Timeout Reset Output/SPI Serial Data Out)
      10. 8.3.10 HSS (High-side Switch)
      11. 8.3.11 HSSC or FSO (High-side Switch Control or Function Output)
      12. 8.3.12 WKRQ or INH (Wake Request or Inhibit)
      13. 8.3.13 PV
      14. 8.3.14 DIV_ON
      15. 8.3.15 VBAT (Battery Voltage)
      16. 8.3.16 VSUP (Supply Voltage)
      17. 8.3.17 GND (Ground)
      18. 8.3.18 EN or nINT (Enable Input or Interrupt Output)
      19. 8.3.19 nRST (Reset Input and Reset Output)
      20. 8.3.20 VCC (Supply Output)
      21. 8.3.21 VBAT Voltage Divider
      22. 8.3.22 Protection Features
        1. 8.3.22.1  Sleep Wake Error (SWE) Timer
        2. 8.3.22.2  Device Reset
        3. 8.3.22.3  TXD Dominant Time Out (DTO)
        4. 8.3.22.4  Bus Stuck Dominant System Fault: False Wake Up Lockout
        5. 8.3.22.5  Thermal Shutdown
        6. 8.3.22.6  Under-voltage on VSUP
        7. 8.3.22.7  Unpowered Device and LIN Bus
        8. 8.3.22.8  Floating Pins
        9. 8.3.22.9  VCC Voltage Regulator
          1. 8.3.22.9.1 Under or Over Voltage and Short Circuit
          2. 8.3.22.9.2 Output Capacitance Selection
          3. 8.3.22.9.3 Low-Voltage Tracking
          4. 8.3.22.9.4 Power Supply Recommendation
        10. 8.3.22.10 Watchdog
          1. 8.3.22.10.1 Watchdog in Pin Control Mode
          2. 8.3.22.10.2 Watchdog in SPI Control Mode
          3. 8.3.22.10.3 Watchdog Error Counter
          4. 8.3.22.10.4 Pin Control Mode
          5. 8.3.22.10.5 SPI Control Programming
          6. 8.3.22.10.6 Watchdog Register Relationship
          7. 8.3.22.10.7 Watchdog Timing
      23. 8.3.23 Channel Expansion
        1. 8.3.23.1 Channel Expansion for LIN
        2. 8.3.23.2 Channel Expansion for CAN Transceiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Init Mode
      2. 8.4.2 Normal Mode
      3. 8.4.3 Fast Mode
      4. 8.4.4 Sleep Mode
      5. 8.4.5 Standby Mode
      6. 8.4.6 Restart Mode
        1. 8.4.6.1 Restart Counter
        2. 8.4.6.2 nRST Behavior in Restart Mode
      7. 8.4.7 Fail-safe Mode
      8. 8.4.8 Wake Up Events
        1. 8.4.8.1 Wake Up Request (RXD)
        2. 8.4.8.2 Local Wake Up (LWU) via WAKE Terminal
          1. 8.4.8.2.1 Static WAKE
          2. 8.4.8.2.2 Cyclic Sense Wake
      9. 8.4.9 Mode Transitions
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 Cyclic Redundancy Check
        2. 8.5.1.2 Chip Select Not (nCS)
        3. 8.5.1.3 Serial Clock Input (CLK)
        4. 8.5.1.4 Serial Data Input (SDI)
        5. 8.5.1.5 Serial Data Output (SDO)
    6. 8.6 Registers
      1. 8.6.1  DEVICE_ID_y Register (Address = 0h + formula) [reset = 0h]
      2. 8.6.2  REV_ID_MAJOR Register (Address = 8h) [reset = 01h]
      3. 8.6.3  REV_ID_MINOR Register (Address = 9h) [reset = 0h]
      4. 8.6.4  CRC_CNTL Register (Address = Ah) [reset = 0h]
      5. 8.6.5  CRC_POLY_SET (Address = Bh) [reset = 00h]
      6. 8.6.6  Scratch_Pad_SPI Register (Address = Fh) [reset = 0h]
      7. 8.6.7  WAKE_PIN_CONFIG1 Register (Address = 11h) [reset = 04h]
      8. 8.6.8  WAKE_PIN_CONFIG2 Register (Address = 12h) [reset = 2h]
      9. 8.6.9  WD_CONFIG_1 Register (Address = 13h) [reset = 90h]
      10. 8.6.10 WD_CONFIG_2 Register (Address = 14h) [reset = 02h]
      11. 8.6.11 WD_INPUT_TRIG Register (Address = 15h) [reset = 0h]
      12. 8.6.12 WD_RST_PULSE Register (Address = 16h) [reset = 40h]
      13. 8.6.13 FSM_CONFIG Register (Address = 17h) [reset = 0h]
      14. 8.6.14 FSM_CNTR Register (Address = 18h) [reset = 0h]
      15. 8.6.15 DEVICE_RST Register (Address = 19h) [reset = 0h]
      16. 8.6.16 DEVICE_CONFIG (Address = 1Ah) [reset = 80h]
      17. 8.6.17 DEVICE_CONFIG2 (Address = 1Bh) [reset = 0h]
      18. 8.6.18 SWE_TIMER (Address = 1Ch) [reset = 30h]
      19. 8.6.19 LIN_CNTL (Address = 1Dh) [reset = 00h]
      20. 8.6.20 HSS_CNTL (Address = 1Eh) [reset = 0h]
      21. 8.6.21 PWM1_CNTL1 (Address = 1Fh) [reset = 0h]
      22. 8.6.22 PWM1_CNTL2 (Address = 20h) [reset = 0h]
      23. 8.6.23 PWM1_CNTL3 (Address = 21h) [reset = 00h]
      24. 8.6.24 PWM2_CNTL1 (Address = 22h) [reset = 0h]
      25. 8.6.25 PWM2_CNTL2 (Address = 23h) [reset = 0h]
      26. 8.6.26 PWM2_CNTL3 (Address = 24h) [reset = 0h]
      27. 8.6.27 TIMER1_CONFIG (Address = 25h) [reset = 00h]
      28. 8.6.28 TIMER2_CONFIG (Address = 26h) [reset = 00h]
      29. 8.6.29 RSRT_CNTR (Address = 28h) [reset = 40h]
      30. 8.6.30 nRST_CNTL (Address = 29h) [reset = 00h]
      31. 8.6.31 INT_GLOBAL Register (Address = 50h) [reset = A0h]
      32. 8.6.32 INT_1 Register (Address = 51h) [reset = 0h]
      33. 8.6.33 INT_2 Register (Address = 52h) [reset = 40h]
      34. 8.6.34 INT_3 Register (Address 53h) [reset = 0h]
      35. 8.6.35 INT_EN_1 Register (Address = 56h) [reset = B0h]
      36. 8.6.36 INT_EN_2 Register (Address = 57h) [reset = 37h]
      37. 8.6.37 INT_EN_3 Register (Address =58h) [reset = BCh]
      38. 8.6.38 INT_4 Register (Address = 5Ah) [reset = 0h]
      39. 8.6.39 INT_EN_4 Register (Address = 5Eh) [reset = CCh]
      40. 8.6.40 Reserved Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Brownout Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Normal Mode Application Note
        2. 9.2.1.2 Standby Mode Application Note
        3. 9.2.1.3 TXD Dominant State Timeout Application Note
      2. 9.2.2 Detailed Design Procedures
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 商标
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.22.5 Thermal Shutdown

The TLIN1431x-Q1 has multiple thermal sensors in the device to monitor the junction temperature of the die. The VCC LDO, LIN transmitter, and high side switch/LIMP cells are monitored. Depending upon which cell's junction temperature are exceeded will determine the action taken by the device. Exceeding the maximum junction temperature for the LIN transmitter or LDO will cause the LIN transmitter into the recessive state and turns off the VCC regulator. The nRST pin is pulled to ground during a LIN or VCC LDO TSD event. Once the over temperature fault condition has been removed and the junction temperature has cooled beyond the hysteresis temperature, the transmitter can be re-enabled. Exceeding the max junction temperature of the high side switch or LIMP cells will cause the cells to be turned off.

In pin control mode, a TSD event on the LIN transceiver or VCC LDO causes the device enters a fail-safe mode. Once the TSD fault has been removed and a wake event takes place, the device enters restart mode. If a wake event takes place and the TSD fault has not cleared, the device enters sleep mode immediately. Exceeding the max junction temperature for the high side switch and LIMP high side switch cause the switches to be turned off until junction temperature falls below TSDF.

In SPI mode, there are two interrupts that can be set due to a thermal event. If the LIN transceiver or VCC LDO junction temperature is exceeded, the TSD_VCC_LIN interrupt is set and the devices takes the action previously described. If the high side switch or LIMP high side switch max junction temperature is exceeded, the TSD_HSS_LIMP interrupt is set. The device takes the action previously described. In SPI mode, the device defaults to support fail-safe mode. The device enters fail-safe mode upon an TSD_VCC_LIN event and LIMP is turned on (see Figure 8-25). Exiting fail-safe mode is the same as when the device is pin controlled. When fail-safe mode is disabled, the device enters sleep mode upon a TSD_VCC_LIN event.