ZHCSS29R April   2004  – April 2024 TL103W , TL103WA , TL103WB

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: OP AMP1 (VREF at Noninverting input)
    6. 5.6 Electrical Characteristics: OP AMP2 (Independent Amplifier)
    7. 5.7 Typical Characteristics: TL103WB
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Internal Reference
      2. 6.3.2 Input Common Mode Range
      3. 6.3.3 EMI Rejection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Isolated Flyback CC/CV Feedback
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Constant Current Circuit
          2. 7.2.1.2.2 Constant Voltage Circuit
      2. 7.2.2 Constant Current Sink
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) TL103Wx UNIT
SOIC (D) SOT-23 (DDF)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 135.4 170.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.3 89.7 °C/W
RθJB Junction-to-board thermal resistance 78.9 87.5 °C/W
ΨJT Junction-to-top characterization parameter 27.4 7.5 °C/W
ΨJB Junction-to-board characterization parameter 78.1 87.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.