ZHCSMF8M December   2003  – November 2022 SN74LVC1T45

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics (VCCA = 1.8 V ± 0.15 V)
    7. 6.7  Switching Characteristics (VCCA = 2.5 V ± 0.2 V)
    8. 6.8  Switching Characteristics (VCCA = 3.3 V ± 0.3 V)
    9. 6.9  Switching Characteristics (VCCA = 5 V ±0.5 V)
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 8.3.2 Support High Speed Translation
      3. 8.3.3 Ioff Supports Partial Power-Down Mode Operation
      4. 8.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 8.3.5 Vcc Isolation
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Unidirectional Logic Level-Shifting Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Logic Level-Shifting Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Enable Times
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision L (February 2017) to Revision M (November 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated the thermals in the Thermal Information sectionGo
  • Updated the Switching Characterisitcs sections: extended some minimum specifications for lower delays Go
  • Updated the Ioff Supports Partial Power-Down Mode Operation sectionGo
  • Added the Balanced High-Drive CMOS Push-Pull Outputs and VCC Isolation sectionsGo
  • Updated the Power Supply Recommendations sectionGo

Changes from Revision K (December 2014) to Revision L (February 2017)

  • 添加了 DPK (USON) 封装信息Go
  • 添加了文档支持 部分、接收文档更新通知 部分和社区资源 部分Go
  • Added Junction temperature, TJ in Absolute Maximum Ratings Go

Changes from Revision J (December 2013) to Revision K (December 2014)

  • 添加了引脚配置和功能 部分、ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go

Changes from Revision I (December 2011) to Revision J (December 2013)

  • 将文档更新为新的 TI 数据表格式 - 无规格变化Go
  • 删除了订购信息Go
  • 添加了 ESD 警告Go