ZHCSTR9H October   1993  – November 2023 SN65LBC175 , SN75LBC175

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) SOIC (D) SOIC (DW) PDIP (N) UNIT
16 Pins 16 Pins 16 Pins
R θJA Junction-to-ambient thermal resistance 84.6 71.1 60.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.5 37.4 48.1 °C/W
R θJB Junction-to-board thermal resistance 43.2 36.8 40.6 °C/W
ψ JT Junction-to-top characterization parameter 10.4 13.3 27.5 °C/W
ψ JB Junction-to-board characterization parameter 42.8 36.4 40.3 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.