ZHCSJ17H November   2002  – November 2018 SN65HVD233 , SN65HVD234 , SN65HVD235

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      方框图
  4. 修订历史记录
  5. (说明 (续))
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Dissipation Ratings
    6. 8.6  Electrical Characteristics: Driver
    7. 8.7  Electrical Characteristics: Receiver
    8. 8.8  Switching Characteristics: Driver
    9. 8.9  Switching Characteristics: Receiver
    10. 8.10 Switching Characteristics: Device
    11. 8.11 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagrams
    3. 10.3 Feature Description
      1. 10.3.1 Diagnostic Loopback (SN65HVD233)
      2. 10.3.2 Autobaud Loopback (SN65HVD235)
      3. 10.3.3 Slope Control
      4. 10.3.4 Standby
      5. 10.3.5 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Driver and Receiver
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Bus Loading, Length and Number of Nodes
        2. 11.2.1.2 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
    3. 11.3 System Example
      1. 11.3.1 ISO 11898 Compliance of SN65HVD23x Family of 3.3-V CAN Transceivers
        1. 11.3.1.1 Introduction
        2. 11.3.1.2 Differential Signal
        3. 11.3.1.3 Common-Mode Signal
        4. 11.3.1.4 Interoperability of 3.3-V CAN in 5-V CAN Systems
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 相关链接
    2. 14.2 接收文档更新通知
    3. 14.3 社区资源
    4. 14.4 商标
    5. 14.5 静电放电警告
    6. 14.6 术语表
  15. 15机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

接收文档更新通知

要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。