ZHCSP38C October   2008  – April 2022 SN54AC00-SP

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Bare Die Information
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics, VCC = 3.3 V
    6. 6.6 Switching Characteristics, VCC = 5 V
    7. 6.7 Operating Characteristics
  7. 7Parameter Measurement Information
  8. 8Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC(1)(2)SN54AC00-SPUNIT
JW
14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance83.1125.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance26.630.85
RθJBJunction-to-board thermal resistance47.943.4
ψJTJunction-to-top characterization parameterN/AN/A
ψJBJunction-to-board characterization parameterN/AN/A
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7 and Mil Std 883 method 1012.1 (see www.JEDEC.org).