ZHCSP38C October   2008  – April 2022 SN54AC00-SP

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Bare Die Information
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics, VCC = 3.3 V
    6. 6.6 Switching Characteristics, VCC = 5 V
    7. 6.7 Operating Characteristics
  7. 7Parameter Measurement Information
  8. 8Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Bare Die Information

DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD
METALLIZATION COMPOSITION		 BOND PAD THICKNESS
15 mils Silicon with backgrind Floating TiW/AlCu2 15800 nm
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Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
1A 1 96.3 510.5 201.3 615.5
1B 2 95 94 200 199
1Y 3 508 94 613 199
2A 4 1149 94 1254 199
2B 5 1562 94 1667 199
2Y 6 1841.5 145.5 1946.5 250.5
GND 7 1841.5 445.5 1946.5 550.5
3Y 8 1841 783 1946 888
3A 9 1750.5 991 1855.5 1096
3B 10 1176.5 991 1281.5 1096
4Y 11 921 991 1026 1096
4A 12 736 991 841 1096
4B 13 95 991 200 1096
VCC 14 102.5 692 207.5 797