ZHCSNA9F April   1977  – January 2021 SG2524 , SG3524

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7 12
    1. 7.1 Electrical Characteristics
    2. 7.2 Electrical Characteristics — Continued, Both Parts
    3. 7.3 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 17
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Blanking
      2. 9.3.2 Error Amplifier
      3. 9.3.3 Compensation
      4. 9.3.4 Output Circuitry
      5. 9.3.5 Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Synchronous Operation
      2. 9.4.2 Shutdown Circuitry
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.2 Input/Output Capacitors

When using a low value ceramic input filter capacitor, it should be located as close to the VIN pin of the IC as possible. This will eliminate as much trace inductance effects as possible and give the internal IC rail a cleaner voltage supply. Some designs require the use of a feed-forward capacitor connected from the output to the feedback pin as well, usually for stability reasons. In this case it should also be positioned as close to the IC as possible. Using surface mount capacitors also reduces lead length and lessens the chance of noise coupling into the effective antenna created by through-hole components.