ZHCSJO8 May   2019 OPA818

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1 特性
  2. 2 应用
    1.     高速光学前端
  3. 3 说明
    1.     光电二极管电容与 3dB 带宽间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = ±5 V
    6. 6.6 Typical Characteristics: VS = ±5 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and ESD Protection
      2. 7.3.2 Feedback Pin
      3. 7.3.3 Decompensated Architecture With Wide Gain-Bandwidth Product
      4. 7.3.4 Low Input Capacitance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (+4/–2 V to ±6.5 V)
      2. 7.4.2 Single-Supply Operation (6 V to 13 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Wideband, Noninverting Operation
      2. 8.1.2 Wideband, Transimpedance Design Using OPA818
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) OPA818 UNIT
DRG (SON)
8 PINS
RθJA Junction-to-ambient thermal resistance 54.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.0 °C/W
RθJB Junction-to-board thermal resistance 27.2 °C/W
ΨJT Junction-to-top characterization parameter 1.8 °C/W
ΨJB Junction-to-board characterization parameter 27.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.