ZHCSIQ3B September   2018  – June 2019 OPA2156

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      低输入电压噪声频谱密度
      2.      OPA2156 跨阻配置
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA2156
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 Thermal Considerations
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Common-Mode Voltage Range
      6. 7.3.6 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Slew Rate Limit for Input Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI（免费软件下载）
        2. 11.1.1.2 TI 高精度设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information: OPA2156

THERMAL METRIC(1) OPA2156 UNIT
8 PINS
D (SOIC) DGK (VSSOP)
RθJA Junction-to-ambient thermal resistance 119.2 163.8 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 51.1 52.5 °C/W
RθJB Junction-to-board thermal resistance 64.7 86.5 °C/W
ψJT Junction-to-top characterization parameter 9.7 5.1 °C/W
ψJB Junction-to-board characterization parameter 63.5 84.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.