ZHCSPA0 September   2023 LP5813

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. Typical Characteristics
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
        7. 9.3.1.7 Pass-Through Mode
      2. 9.3.2 Time-cross-multiplexing (TCM) scheme
        1. 9.3.2.1 Direct drive mode
        2. 9.3.2.2 TCM drive mode
        3. 9.3.2.3 Mix drive mode
        4. 9.3.2.4 Ghosting elimination
      3. 9.3.3 Analog Dimming
      4. 9.3.4 PWM Dimming
      5. 9.3.5 Autonomous Animation Engine Control
        1. 9.3.5.1 Animation Engine Pattern
        2. 9.3.5.2 Sloper
        3. 9.3.5.3 Animation Engine Unit (AEU)
        4. 9.3.5.4 Animation Pause Unit (APU)
      6. 9.3.6 Protections and Diagnostics
        1. 9.3.6.1 Overvoltage Protection
        2. 9.3.6.2 Output Short-to-Ground Protection
        3. 9.3.6.3 LED Open Detections
        4. 9.3.6.4 LED Short Detections
        5. 9.3.6.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Map Table
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Thermal Shutdown

The LED driver of LP5813 goes into thermal shutdown state once the junction temperature exceeds 150°C. All LEDs turn off to avoid damaging the device. When the junction temperature drops below the thermal shutdown recovery temperature 130°C, the LED driver starts operating again.

The boost converter of LP5813 stops switching and is shutdown once the junction temperature exceeds 155°C, and the power on reset of the LED driver part is also triggered. When the junction temperature drops below the thermal shutdown recovery temperature, typically 130°C, the LP5813 enters shutdown state, and then the device needs to be configured again for normal operations.