ZHCSPA0 September   2023 LP5813

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. Typical Characteristics
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
        7. 9.3.1.7 Pass-Through Mode
      2. 9.3.2 Time-cross-multiplexing (TCM) scheme
        1. 9.3.2.1 Direct drive mode
        2. 9.3.2.2 TCM drive mode
        3. 9.3.2.3 Mix drive mode
        4. 9.3.2.4 Ghosting elimination
      3. 9.3.3 Analog Dimming
      4. 9.3.4 PWM Dimming
      5. 9.3.5 Autonomous Animation Engine Control
        1. 9.3.5.1 Animation Engine Pattern
        2. 9.3.5.2 Sloper
        3. 9.3.5.3 Animation Engine Unit (AEU)
        4. 9.3.5.4 Animation Pause Unit (APU)
      6. 9.3.6 Protections and Diagnostics
        1. 9.3.6.1 Overvoltage Protection
        2. 9.3.6.2 Output Short-to-Ground Protection
        3. 9.3.6.3 LED Open Detections
        4. 9.3.6.4 LED Short Detections
        5. 9.3.6.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Map Table
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.