ZHCSD18A March   2013  – October 2014 LP55231

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Charge Pump Electrical Characteristics
    7. 6.7  LED Driver Electrical Characteristics
    8. 6.8  LED Test Electrical Characteristics
    9. 6.9  Logic Interface Characteristics
    10. 6.10 Recommended External Clock Source Conditions
    11. 6.11 Serial Bus Timing Parameters (SDA, SCL)
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Programming
      2. 7.3.2 LED Error Detection
      3. 7.3.3 Energy Efficiency
      4. 7.3.4 Temperature Compensation
      5. 7.3.5 Charge Pump Operational Description
        1. 7.3.5.1 Overview
        2. 7.3.5.2 Output Resistance
        3. 7.3.5.3 Controlling The Charge Pump
        4. 7.3.5.4 LED Forward Voltage Monitoring
        5. 7.3.5.5 Gain Change Hysteresis
      6. 7.3.6 LED Driver Operational Description
        1. 7.3.6.1 Overview
        2. 7.3.6.2 Powering LEDs
        3. 7.3.6.3 Controlling The High-Side LED Drivers
      7. 7.3.7 Automatic Power-Save Mode
      8. 7.3.8 PWM Power-Save Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes Of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Control Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start And Stop Conditions
        3. 7.5.1.3 Transferring Data
      2. 7.5.2 I2C-Compatible Chip Address
        1. 7.5.2.1 Control Register Write Cycle
        2. 7.5.2.2 Control Register Read Cycle
        3. 7.5.2.3 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Set
      2. 7.6.2 Control Register Details
      3. 7.6.3 Instruction Set
      4. 7.6.4 LED Driver Instructions
        1. 7.6.4.1 Ramp
        2. 7.6.4.2 Ramp Instruction Application Example
        3. 7.6.4.3 Set_PWM
        4. 7.6.4.4 Wait
      5. 7.6.5 LED Mapping Instructions
        1. 7.6.5.1  MUX_LD_START; MUX_LD_END
        2. 7.6.5.2  MUX_MAP_START
        3. 7.6.5.3  MUX_SEL
        4. 7.6.5.4  MUX_CLR
        5. 7.6.5.5  MUX_MAP_NEXT
        6. 7.6.5.6  MUX_LD_NEXT
        7. 7.6.5.7  MUX_MAP_PREV
        8. 7.6.5.8  MUX_LD_PREV
        9. 7.6.5.9  MUX_MAP_ADDR
        10. 7.6.5.10 MUX_LD_ADDR
      6. 7.6.6 Branch Instructions
        1. 7.6.6.1 BRANCH
        2. 7.6.6.2 INT
        3. 7.6.6.3 RST
        4. 7.6.6.4 END
        5. 7.6.6.5 TRIGGER
      7. 7.6.7 Arithmetic Instructions
        1. 7.6.7.1 LD
        2. 7.6.7.2 ADD
        3. 7.6.7.3 SUB
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Using Two LP55231 in the Same Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Driving Haptic Feedback with LP55231
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。

11.2 商标

All other trademarks are the property of their respective owners.

11.3 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.4 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。