ZHCSEA3U June   2007  – January 2018 LP3907

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
  4. 4 修订历史记录
  5. 5 器件比较 台式机
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions (Bucks)
    4. 7.4  Thermal Information
    5. 7.5  General Electrical Characteristics
    6. 7.6  Low Dropout Regulators, LDO1 And LDO2
    7. 7.7  Buck Converters SW1, SW2
    8. 7.8  I/O Electrical Characteristics
    9. 7.9  Power-On Reset (POR) Threshold/Function
    10. 7.10 I2C Interface Timing Requirements
    11. 7.11 Typical Characteristics — LDO
    12. 7.12 Typical Characteristics — Bucks
    13. 7.13 Typical Characteristics — Buck1
    14. 7.14 Typical Characteristics — Buck2
    15. 7.15 Typical Characteristics — Bucks
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DC-DC Converters
        1. 8.3.1.1 Linear Low Dropout Regulators (LDOs)
        2. 8.3.1.2 No-Load Stability
        3. 8.3.1.3 LDO and LDO2 Control Registers
      2. 8.3.2 SW1, SW2: Synchronous Step-Down Magnetic DC-DC Converters
        1. 8.3.2.1  Functional Description
        2. 8.3.2.2  Circuit Operation Description
        3. 8.3.2.3  PWM Operation
        4. 8.3.2.4  Internal Synchronous Rectification
        5. 8.3.2.5  Current Limiting
        6. 8.3.2.6  PFM Operation
        7. 8.3.2.7  SW1, SW2 Operation
        8. 8.3.2.8  SW1, SW2 Control Registers
        9. 8.3.2.9  Soft Start
        10. 8.3.2.10 Low Dropout Operation
        11. 8.3.2.11 Flexible Power Sequencing of Multiple Power Supplies
        12. 8.3.2.12 Power-Up Sequencing Using the EN_T Function
      3. 8.3.3 Flexible Power-On Reset (Power Good with Delay)
      4. 8.3.4 Undervoltage Lockout
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Serial Interface
        1. 8.5.1.1 I2C Signals
        2. 8.5.1.2 I2C Data Validity
        3. 8.5.1.3 I2C Start and Stop Conditions
        4. 8.5.1.4 Transferring Data
      2. 8.5.2 Factory Programmable Options
    6. 8.6 Register Maps
      1. 8.6.1 LP3907 Control Registers
        1. 8.6.1.1  Interrupt Status Register (ISRA) 0x02
        2. 8.6.1.2  Control 1 Register (SCR1) 0x07
        3. 8.6.1.3  EN_DLY Preset Delay Sequence After EN_T Assertion
        4. 8.6.1.4  Buck and LDO Output Voltage Enable Register (BKLDOEN) – 0x10
        5. 8.6.1.5  Buck and LDO Status Register (BKLDOSR) – 0x11
        6. 8.6.1.6  Buck Voltage Change Control Register 1 (VCCR) – 0x20
        7. 8.6.1.7  Buck1 Target Voltage 1 Register (B1TV1) – 0x23
        8. 8.6.1.8  Buck1 Target Voltage 2 Register (B1TV2) – 0x24
        9. 8.6.1.9  Buck1 Ramp Control Register (B1RC) - 0x25
        10. 8.6.1.10 Buck2 Target Voltage 1 Register (B2TV1) – 0x29
        11. 8.6.1.11 Buck2 Target Voltage 2 Register (B2TV2) – 0x2A
        12. 8.6.1.12 Buck2 Ramp Control Register (B2RC) - 0x2B
        13. 8.6.1.13 Buck Function Register (BFCR) – 0x38
        14. 8.6.1.14 LDO1 Control Register (LDO1VCR) – 0x39
        15. 8.6.1.15 LDO2 Control Register (LDO2VCR) – 0x3A
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Component Selection
          1. 9.2.2.2.1 Inductors for SW1 And SW2
            1. 9.2.2.2.1.1 Method 1:
            2. 9.2.2.2.1.2 Method 2:
          2. 9.2.2.2.2 External Capacitors
        3. 9.2.2.3 LDO Capacitor Selection
          1. 9.2.2.3.1 Input Capacitor
          2. 9.2.2.3.2 Output Capacitor
          3. 9.2.2.3.3 Capacitor Characteristics
          4. 9.2.2.3.4 Input Capacitor Selection for SW1 And SW2
          5. 9.2.2.3.5 Output Capacitor Selection for SW1, SW2
          6. 9.2.2.3.6 I2C Pullup Resistor
        4. 9.2.2.4 Operation Without I2C Interface
          1. 9.2.2.4.1 High VIN High-Load Operation
          2. 9.2.2.4.2 Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Analog Power Signal Routing
  11. 11Layout
    1. 11.1 DSBGA Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations of WQFN Package
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 商标
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.1.1.1 使用 WEBENCH® 工具创建定制设计

单击此处，使用 LP3907 器件并借助 WEBENCH® 电源设计器创建定制设计方案。

  1. 首先键入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
  2. 使用优化器拨盘优化关键参数设计，如效率、封装和成本。
  3. 将生成的设计与德州仪器 (TI) 的其他解决方案进行比较。

WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。

在多数情况下，可执行以下操作：

  • 运行电气仿真，观察重要波形以及电路性能
  • 运行热性能仿真，了解电路板热性能
  • 将定制原理图和布局方案导出至常用 CAD 格式
  • 打印设计方案的 PDF 报告并与同事共享

有关 WEBENCH 工具的详细信息，请访问 www.ti.com/WEBENCH。