SNVS522I August   2007  – August 2015 LP38501-ADJ , LP38503-ADJ

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Stability and Phase Margin
      2. 7.3.2 Load Transient Response
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Reverse Current Path
      5. 7.3.5 Short-Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Operation (LP38501-ADJ Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Setting The Output Voltage
        5. 8.2.2.5 RFI/EMI Susceptibility
        6. 8.2.2.6 Output Noise
        7. 8.2.2.7 Power Dissipation/Heatsinking
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (April 2013) to I Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Rating and updated Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; remove lead temp from Abs Max table (in POA); remove obsolete heatsinking content; update thermal valuesGo
  • Deleted obsolete heatsinking information for DDPAK/TO-263 package Go

Changes from G Revision (April 2013) to H Revision

  • Changed layout of National data sheet to TI format Go