ZHCSU09H July   2004  – December 2023 LP2981 , LP2981A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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5.5 Electrical Characteristics

specified at TJ = 25 °C, VIN = VOUT(nom) + 1.0 V or VIN = 2.5 V (whichever is greater), IOUT = 1 mA, VON/OFF = 2 V, CIN = 1.0 µF, and COUT = 2.2 µF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
∆VOUT Output voltage tolerance IL = 1 mA Legacy chip (Standard grade) –1.25 1.25 %
Legacy chip (A grade) –0.75 0.75 %
New chip –0.5 0.5 %
1 mA < IL < 100 mA Legacy chip (Standard grade) –2.0 2.0 %
Legacy chip (A grade) –1.0 1.0 %
New chip –0.5 0.5 %
1 mA < IL < 100 mA, –40°C ≤ TJ ≤ 125°C Legacy chip (Standard grade) –3.5 3.5 %
Legacy chip (A grade) –2.5 2.5 %
New chip –1 1 %
ΔVOUT(ΔVIN) Line regulation VO(NOM) + 1 V ≤ VIN ≤ 16 V Legacy chip 0.007 0.014 %/V
New chip 0.002 0.014
VO(NOM) + 1 V ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C Legacy chip 0.007 0.032
New chip 0.002 0.032
ΔVOUT(ΔILOAD) Load regulation 1 mA < IL < 100 mA, –40°C ≤ TJ ≤ 125°C, VIN = VO(NOM)+0.5 V New chip 0.1 0.5 %/A
VIN - VOUT Dropout voltage(1) IOUT = 0 mA Legacy chip 1 3 mV
New chip 1 2.75
IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 5
New chip 3
IOUT = 1 mA Legacy chip 7 10
New chip 11.5 14
IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 15
New chip 17
IOUT = 25 mA Legacy chip 70 100
New chip 110 132
IOUT = 25 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 150
New chip 167
IOUT = 100 mA Legacy chip 200 250
New chip 160 175
IOUT = 100 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 375
New chip 218
IGND GND pin current IOUT = 0 mA Legacy chip 65 95 µA
New chip 69 95
IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 125
New chip 123
IOUT = 1 mA Legacy chip 80 110
New chip 78 110
IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 170
New chip 140
IOUT = 25 mA Legacy chip 200 300
New chip 225 295
IOUT = 25 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 550
New chip 345
IOUT = 100 mA Legacy chip 600 1000
New chip 620 790
IOUT = 100 mA, –40°C ≤ TJ ≤ 125°C Legacy chip 1700
New chip 950
VON/OFF < 0.3 V, VIN = 16 V Legacy chip 0.01 0.8
New chip 1.25 1.75
VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 105°C Legacy chip 0.05 2
VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 125°C 5
New chip 1.12 2.75
VUVLO+ Rising bias supply UVLO VIN rising, –40°C ≤ TJ ≤ 125°C New chip 2.2 2.4 V
VUVLO- Falling bias supply UVLO VIN falling, –40°C ≤ TJ ≤ 125°C 1.9
VUVLO(HYST) UVLO hysteresis –40°C ≤ TJ ≤ 125°C 0.130
IO(SC) Short Output Current RL = 0 Ω (steady state) Legacy chip 150 mA
New chip 150
VON/OFF ON/OFF input voltage Low = Output OFF Legacy chip 0.5 V
New chip 0.72
Low = Output OFF, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C Legacy chip 0.15
New chip 0.15
High = Output ON Legacy chip 1.4
New chip 0.85
High = Output ON, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C Legacy chip 1.6
New chip 1.6
ION/OFF ON/OFF input current VON/OFF = 0 V Legacy chip 0.01 µA
New chip 0.42
VON/OFF = 0 V, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C Legacy chip –1
New chip –0.9
VON/OFF = 5 V Legacy chip 5
New chip 0.011
VON/OFF = 5 V, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C Legacy chip 15
New chip 2.20
IO(PK) Peak output current VOUT ≥ VO(NOM) –5% (steady state) Legacy chip 400 mA
New chip 350
ΔVO/ΔVIN Ripple Rejection f = 1 kHz, COUT = 10 µF Legacy chip 63 dB
New chip 75
Vn Output noise voltage Bandwidth = 300 Hz to 50 kHz, COUT = 2.2 µF, VOUT = 3.3 V, ILOAD = 150 mA Legacy chip 160 µVRMS
Bandwidth = 300 Hz to 50 kHz, COUT = 2.2 µF, VOUT = 3.3 V, ILOAD = 150 mA New chip 140
Tsd+ Thermal shutdown threshold Shutdown, temperature increasing New chip 170 °C
Tsd- Reset, temperature decreasing 150
(1) Dropout voltage (VDO) is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a 1-V differential. VDO is measured with VIN = VOUT(nom) – 100 mV for fixed output devices.