ZHCSIE8C June   2018  – October 2020 LMR33630-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 System Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Good Flag Output
      2. 7.3.2 Enable and Start-up
      3. 7.3.3 Current Limit and Short Circuit
      4. 7.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto Mode
      2. 7.4.2 Dropout
      3. 7.4.3 Minimum Switch On-Time
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Input Capacitor Selection
        7. 8.2.2.7  CBOOT
        8. 8.2.2.8  VCC
        9. 8.2.2.9  CFF Selection
        10. 8.2.2.10 External UVLO
        11. 8.2.2.11 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 支持资源
    4. 11.4 接收文档更新通知
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNX|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

Figure 5-1 12-Pin VQFN RNX Package (Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1, 11 PGND G Power ground terminal. Connect to system ground and AGND. Connect to a bypass capacitor with short wide traces.
2, 10 VIN P Input supply to regulator. Connect a high-quality bypass capacitor(s) directly to this pin and PGND.
3 NC — On the VQFN package, connect the SW pin to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin. This pin has no internal connection to the regulator.
4 BOOT P Boot-strap supply voltage for internal high-side driver. Connect a high-quality 100-nF capacitor from this pin to the SW pin. On the VQFN package connect the SW pin to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin.
5 VCC P Internal 5-V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high quality 1-µF capacitor from this pin to GND.
6 AGND G Analog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB.
7 FB A Feedback input to regulator. Connect to tap point of feedback voltage divider. DO NOT FLOAT. DO NOT GROUND.
8 PG A Open drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN = Low. Can be left open when not used.
9 EN A Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; DO NOT FLOAT.
12 SW P Regulator switch node. Connect to power inductor. On the VQFN package the SW pin must be connected to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin.
A = Analog, P = Power, G = Ground