ZHCSC60A March   2014  – September  2014 LMP93601

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化热电堆阵列系统图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Noise Performance
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Data Format
      2. 8.3.2  Transfer Function
      3. 8.3.3  Input Routing Mux
      4. 8.3.4  Programmable Gain Amplifier
      5. 8.3.5  PGA Bypass Mode
      6. 8.3.6  Over-Range Detection
      7. 8.3.7  Analog-To-Digital Converter (ADC)
      8. 8.3.8  Programmable Digital Filters
      9. 8.3.9  Common Mode Voltage Generator
      10. 8.3.10 Low Drop-Out Regulator (LDO)
      11. 8.3.11 External Clock
      12. 8.3.12 Operating Modes
      13. 8.3.13 Data Ready Function (DRDYB)
      14. 8.3.14 Synchronous Serial Peripheral Interface (SPI)
      15. 8.3.15 Power Management Mode; Standby, Conversion and Shutdown
      16. 8.3.16 Power-On Sequence and Reset (POR) Function
      17. 8.3.17 Brown-Out Detection Function
      18. 8.3.18 Reset Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single-Shot Mode
      2. 8.4.2 Continuous Mode
    5. 8.5 Programming
      1. 8.5.1 Window to Capture Data and Status
      2. 8.5.2 Single Byte Access
    6. 8.6 Register Maps
    7. 8.7 Multi Byte Access (Auto Increment) Mode
    8. 8.8 Multi-Channel Data Read
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Analog Supply Voltage, AVDD -0.3 6.0 V
Digital Supply Range, IOVDD; ( IOVDD must always be lower than or equal to AVDD supply) -0.3 6.0 V
Voltage between any two analog pins 6.0 V
Voltage between any two digital pins 6.0 V
Voltage between XCAP2 and any GND (A, D or IO) 2.2 V
Input current at any pin -5.0 +5.0 mA
Junction Temperature 125 °C
(1) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 K V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500
(1) JEDEC document JEP155 states that 2000 -V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN MAX UNIT
Analog Supply Voltage, AVDD 2.7 5.5 V
Fclk 3.6 4.4 MHz
Digital Supply Voltage, IOVDD 2.7 AVDD V
Supply Ground AGND = DGND = IOGND
Temperature range -25 85 °C

7.4 Thermal Information

SYMBOL THERMAL METRIC WQFN
24 PINS		 UNIT
ΘJA Thermal resistance, junction to ambient 37.9 °C/W
ΘJC Thermal resistance, junction to case 4.8 °C/W
ΨJB Thermal resistance, junction to board 19.4 °C/W

7.5 Electrical Characteristics

Typical conditions: TA=+25⁰C, AVDD=IOVDD=3.3 V, INP1/INN1 enabled with VICM=AVDD/3. PGA gain=64, PGA over-range masked, digital gain=1. SPS select=1057 SPS. fXCLK=4.00 MHz. Conversion power mode. XCAP1=1 uF. XCAP2=0.1 uF.
SYMBOL PARAMETER TEST CONDITION MIN TYP MAX UNIT
INPUTS
XTLK Crosstalk across input channels Channel1 enabled with a 100 kΩ resistor as input, channel 2 disabled with 1 V peak-peak , 100 Hz signal as input. 80 dB 
Zin Differential input impedance 10//7 MΩ//pF (4)
Common mode input impedance 100//4.5 MΩ//pF(4)
IB Input bias current -1.3 nA 
Ios Input offset current on differential channels Maximum of INP1-INN1, .., INP3-INN3 -200 pA
TCIos Input offset current drift on differential channels Maximum of INP1-INN1, .., INP3-INN3 -0.5 pA/⁰C
Vos Input referred offset voltage Input short on chip, PGA 64 DG =1, CH1 -15 1 +15 uV(5)
TCVos Input referred offset drift with temperature Input short on chip 50 nV/⁰C 
Vdiff Input differential range for AVDD≥3V Programmable gain settings =16; ± 3% -64 +64 mV 
Programmable gain settings =32; ± 3% -32 +32
Programmable gain settings =64; ± 3% -16 +16
Programmable gain settings = 128; ± 3% ± 8
PGA bypass ±1 V
VICM Input common mode range. PGA = 64 V/V; CMRR ≥ 80 dB 0.3 AVDD-1.4 V(2)
PGA = 64 V/V ; CMRR ≥ 72 dB
-25 C to 85 C		 0.4 AVDD-1.45
BW Channel bandwidth See Figure 16 Hz
ODR Output data rate 265 SPS
530
1057
1326
PGA Programmable gain settings 16, 32 , 64 and 128 V/V 
Bypass mode 1 V/V
Digital Gain Programmable gain settings 1, 2, 4, 8, 16 and 32 V/V
Total AFE Gain Programmable gain settings (analog and digital) 16 - 4096 V/V
Gain steps 2 x
GE Gain error 0.3 %
PGA bypassed -0.3 %
GE drift with temperature -9 ppm/⁰C
ENOB(1) Effective number of bits 15.3 Bits
THD Total harmonic distortion (Linearity) 100 Hz, 50 mVpp differential input, PGA 16 V/V 91 dB
Noise RMS noise in a 1 kHz BW PGA = 64 V/V 0.67(6) uVrms 
1/ƒ noise corner 1 Hz
CMRR Common mode rejection ratio (at DC) VICM = 0.3 to AVDD-1.4 V 80 127 dB(2)
VICM = 0.4 to AVDD-1.45 V, over operating temperature range
-25 C to 85 C		 72 127
PSRR Power supply rejection ratio (at DC) Supply ; 2.7 to 5.5 V 80 120 dB(2)
Supply ; 2.7 to 5.5 V, over operating temperature range
-25 C to 85 C		 72 120
EMIRR EMI rejection ratio VRF = 100 mVPP dB 
f=400 MHz 86
f=900 MHz 87
f=1800 MHz 85
f=2400 MHz 84
VCM
V VCM Output voltage AVDD/3 V
Tstrp VCM Startup time To within 90% of final value 10 ms 
Acc VCM Accuracy 0.2 %
TC VCM Drift over temperature 0.5 ppm/⁰C 
I VCM Output current 0.5 mA
Load regulation 0 to 200uA 4 15 mV 
Zload VCM Load range 2.2//100 MΩ//nF
SLAVE SPI INTERFACE
Clock frequency 1 20 MHz
DIGITAL INPUT/OUTPUT CHARACTERISTICS
VIH Logical “1” Input Voltage 0.7x
IOVDD		 V
VIL Logical “0” Input Voltage 0.3x
IOVDD		 V
VOH Isource=300uA IOVDD-
0.150
VOL Isink=300uA IOGND
+0.150
POWER SUPPLY
AVDD Analog supply voltage range 2.7 5.5 V
IOVDD Digital supply voltage range AVDD  ≥ IOVDD AVDD V(3)
SUPPLY CURRENT
IIOVDD Digital on AFE Shutdown Mode, XCLK off 0.1 1 µA
Standby Mode 1.9 25 µA
Conversion Power Mode 2.7 25 µA
Conversion Power Mode,
PGA bypassed		 3 µA
IAVDD Analog on AFE Shutdown Mode, XCLK off 0.1 1 µA
Standby Mode 175 250 µA
Conversion Power Mode 1.1 1.6 mA
Conversion Power Mode, 230 μA PGA bypassed 230 µA
TEMPERATURE RANGE
Operating –25 85 °C
(1) ENOB is a DC ENOB spec, not the dynamic ENOB that is measured using FFT and SINAD:
eq01_snas633.gif
(2) Temperature limits are ensured by statistical analysis or design
(3) IOVDD always ≤ AVDD and IOVDD minimum is 2.7 V
(4) Value from simulation
(5) The input referred offset is measure by an on-chip short.
(6) See Table 1 for detailed noise performance

7.6 Timing Requirements

Under typical conditions with maximum total load capacitance 10 pF.
MIN TYP MAX UNIT
tPH High Period, SCLK 25 ns
tPL Low Period, SCLK 25 ns
tSU SDI input setup time 10 ns
tH SDI input hold time 10 ns
tOD SDO output hold time 13.5 ns
tCSS CSB setup time 25 ns
tCSH CSB hold time 25 ns
tIAG CSB high time 50 ns
td_SPI_write_snas633.gifFigure 1. SPI Write Timing Diagram
td_single_byte_read_snas633.gifFigure 2. SPI Read Timing Diagram

7.7 Noise Performance

Table 1. Noise In µVRMS at AVDD= 3.3 V, AGND = 0 V, and Internal Reference = 2.4 VRMS

ODR (SPS) PGA Gain (V/V) D-Gain (V/V) Vn (uVrms)
265 16 1 Below the resolution
of the 16 bit SDM.
2 Below the resolution
of the 16 bit SDM.
4 0.661
8 0.597
16 0.578
32 0.574
32 1 Below the resolution
of the 16 bit SDM.
2 0.516
4 0.396
8 0.368
16 0.361
32 0.362
64 1 0.556
2 0.321
4 0.287
8 0.281
16 0.275
32 0.277
128 1 0.298
2 0.254
4 0.247
8 0.242
16 0.242
32 0.240
530 16 1 Below the resolution
of the 16 bit SDM.
2 0.944
4 0.888
8 0.831
16 0.810
32 0.816
32 1 0.509
2 0.609
4 0.543
8 0.517
16 0.521
32 0.511
64 1 0.569
2 0.421
4 0.397
8 0.396
16 0.397
32 0.395
128 1 0.377
2 0.348
4 0.340
8 0.341
16 0.340
32 0.339
1057 16 1 1.565
2 1.517
4 1.410
8 1.409
16 1.398
32 1.401
32 1 0.932
2 0.903
4 0.834
8 0.839
16 0.829
32 0.824
64 1 0.667
2 0.596
4 0.580
8 0.580
16 0.579
32 0.574
128 1 0.501
2 0.481
4 0.476
8 0.476
16 0.473
32 0.470
1326 16 1 2.331
2 1.743
4 1.743
8 1.665
16 1.648
32 1.681
32 1 1.189
2 0.975
4 0.981
8 0.954
16 0.941
32 0.937
64 1 0.733
2 0.677
4 0.670
8 0.667
16 0.660
32 0.663
128 1 0.575
2 0.546
4 0.541
8 0.537
16 0.540
32 0.538

7.8 Typical Characteristics

C001_snas633.png
Figure 3. Vos vs AVDD (V)
C003_snas633.png
Figure 5. Ibias vs Temperature
C005_snas633.png
Figure 7. Ibias vs Temperature
C007_snas633.png
Figure 9. IAVDD vs Temperature
C009_snas633.png
Figure 11. I AVDD vs Temperature
C011_snas633.png
Figure 13. IAVDD vs Temperature
C013_snas633.png
Figure 15. GE (%) vs Temperature
C002_snas633.png
Figure 4. Vos vs Vcm (V)
C004_snas633.png
Figure 6. Ios vs Temperature
C006_snas633.png
Figure 8. Ios vs Temperature
C008_snas633.png
Figure 10. IOVDD vs Temperature
C010_snas633.png
Figure 12. IOVDD vs Temperature
C012_snas633.png
Figure 14. IOVDD vs Temperature