ZHCSEM6A February   2016  – February 2016 LM36923H

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enabling the LM36923H
        1. 7.3.1.1 Current Sink Enable
      2. 7.3.2 LM36923H Start-Up
      3. 7.3.3 Brightness Mapping
        1. 7.3.3.1 Linear Mapping
        2. 7.3.3.2 Exponential Mapping
      4. 7.3.4 PWM Input
        1. 7.3.4.1 PWM Sample Frequency
          1. 7.3.4.1.1 PWM Resolution and Input Frequency Range
          2. 7.3.4.1.2 PWM Sample Rate and Efficiency
            1. 7.3.4.1.2.1 PWM Sample Rate Example
        2. 7.3.4.2 PWM Hysteresis
        3. 7.3.4.3 PWM Step Response
        4. 7.3.4.4 PWM Timeout
      5. 7.3.5 LED Current Ramping
      6. 7.3.6 Regulated Headroom Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Brightness Control Modes
        1. 7.4.1.1 I2C Only (Brightness Mode 00)
        2. 7.4.1.2 PWM Only (Brightness Mode 01)
        3. 7.4.1.3 I2C + PWM Brightness Control (Multiply Then Ramp) Brightness Mode 10
        4. 7.4.1.4 I2C + PWM Brightness Control (Ramp Then Multiply) Brightness Mode 11
      2. 7.4.2 Boost Switching Frequency
        1. 7.4.2.1 Minimum Inductor Select
      3. 7.4.3 Auto-Switching Frequency
      4. 7.4.4 I2C Address Select (ASEL)
      5. 7.4.5 Fault Protection/Detection
        1. 7.4.5.1 Overvoltage Protection (OVP)
          1. 7.4.5.1.1 Case 1 OVP Fault Only (OVP Threshold Hit and All Enabled Current Sink Inputs > 40 mV)
          2. 7.4.5.1.2 Case 2a OVP Fault and Open LED String Fault (OVP Threshold Occurrence and Any Enabled Current Sink Input ≤ 40 mV)
          3. 7.4.5.1.3 Case 2b OVP Fault and Open LED String Fault (OVP Threshold Duration and Any Enabled Current Sink Input ≤ 40 mV)
          4. 7.4.5.1.4 OVP/LED Open Fault Shutdown
          5. 7.4.5.1.5 Testing for LED String Open
        2. 7.4.5.2 Voltage Limitations on LED1, LED2, and LED3
        3. 7.4.5.3 LED String Short Fault
        4. 7.4.5.4 Overcurrent Protection (OCP)
          1. 7.4.5.4.1 OCP Fault
          2. 7.4.5.4.2 OCP Shutdown
        5. 7.4.5.5 Device Overtemperature
          1. 7.4.5.5.1 Overtemperature Shutdown
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Start and Stop Conditions
        2. 7.5.1.2 I2C Address
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 Register Programming
    6. 7.6 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Inductor
          2. 8.2.2.1.2 Output Capacitor
          3. 8.2.2.1.3 Input Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Bypassing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 商标
    3. 11.3 社区资源
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.