ZHCSD27 October   2014 LM3648

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flash Mode
      2. 7.3.2 Torch Mode
      3. 7.3.3 IR Mode
    4. 7.4 Device Functioning Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Power Amplifier Synchronization (TX)
      4. 7.4.4 Input Voltage Flash Monitor (IVFM)
      5. 7.4.5 Fault/Protections
        1. 7.4.5.1 Fault Operation
        2. 7.4.5.2 Flash Time-Out
        3. 7.4.5.3 Overvoltage Protection (OVP)
        4. 7.4.5.4 Current Limit
        5. 7.4.5.5 NTC Thermistor Input (Torch/Temp)
        6. 7.4.5.6 Undervoltage Lockout (UVLO)
        7. 7.4.5.7 Thermal Shutdown (TSD)
        8. 7.4.5.8 LED and/or VOUT Short Fault
    5. 7.5 Programming
      1. 7.5.1 Control Truth Table
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 I2C-Compatible Chip Address
    6. 7.6 Register Descriptions
      1. 7.6.1  Enable Register (0x01)
      2. 7.6.2  IVFM Register (0x02)
      3. 7.6.3  LED Flash Brightness Register (0x03)
      4. 7.6.4  LED Torch Brightness Register (0x05)
      5. 7.6.5  Boost Configuration Register (0x07)
      6. 7.6.6  Timing Configuration Register (0x08)
      7. 7.6.7  TEMP Register (0x09)
      8. 7.6.8  Flags1 Register (0x0A)
      9. 7.6.9  Flags2 Register (0x0B)
      10. 7.6.10 Device ID Register (0x0C)
      11. 7.6.11 Last Flash Register (0x0D)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Inductor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
IN, SW, OUT, LED −0.3 6 V
SDA, SCL, TX, TORCH/TEMP, HWEN, STROBE −0.3 to the lesser of (VIN+0.3) w/ 6 V max
Continuous power dissipation(3) Internally limited
Junction temperature (TJ-MAX) 150 °C
Maximum lead temperature (soldering) See(4)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND terminal.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 135°C (typ.). Thermal shutdown is ensured by design.
(4) For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package (SNVA009).

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range −65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) −2500 2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) −1500 1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN 2.5 5.5 V
Junction temperature (TJ) −40 125 °C
Ambient temperature (TA) (3) −40 85
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) LM3648 UNIT
DSBGA (YFF)
12 PINS
RθJA Junction-to-ambient thermal resistance 90.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.5 °C/W
RθJB Junction-to-board thermal resistance 40.0 °C/W
ΨJT Junction-to-top characterization parameter 3.0 °C/W
ΨJB Junction-to-board characterization parameter 39.2 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typical limits tested at TA = 25°C. Minimum and maximum limits apply over the full operating ambient temperature range (−40°C ≤ TA ≤ 85°C). Unless otherwise specified, VIN = 3.6 V, HWEN = VIN.(2)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT SOURCE SPECIFICATIONS
ILED Current source accuracy VOUT = 4 V, flash code = 0x3F = 1.5 A flash –7% 1.5 7% A
VOUT = 4 V, torch code = 0x3F = 178.6 mA torch –10% 178.6 10% mA
VHR LED current source regulation voltage ILED = 1.5 A Flash 290 mV
ILED = 178.6 mA Torch 158
VOVP ON threshold 4.86 5 5.1 V
OFF threshold 4.75 4.88 4.99
STEP-UP DC/DC CONVERTER SPECIFICATIONS
RPMOS PMOS switch on-resistance 86 mΩ
RNMOS NMOS switch on-resistance 65
ICL Switch current limit Reg 0x07, bit[0] = 0 –12% 1.9 12% A
Reg 0x07, bit[0] = 1 –12% 2.8 12%
VUVLO Undervoltage lockout threshold Falling VIN –2% 2.5 2% V
VTRIP NTC comparator trip threshold Reg 0x09, bits[3:1] = '100' –5% 0.6 5% V
INTC NTC current –6% 50 6% µA
VIVFM Input voltage flash monitor trip threshold Reg 0x02, bits[5:3] = '000' –3% 2.9 3% V
IQ Quiescent supply current Device not switching pass mode 0.3 0.75 mA
ISD Shutdown supply current Device disabled, HWEN = 0 V
2.5 V ≤ VIN ≤ 5.5 V		 0.1 4 µA
ISB Standby supply current Device disabled, HWEN = 1.8 V
2.5 V ≤ VIN ≤ 5.5 V		 2.5 10 µA
HWEN, TORCH/TEMP, STROBE, TX VOLTAGE SPECIFICATIONS
VIL Input logic low 2.5 V ≤ VIN ≤ 5.5 V 0 0.4 V
VIH Input logic high 1.2 VIN
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL Input logic low 2.5 V ≤ VIN ≤ 4.2 V 0 0.4 V
VIH Input logic high 1.2 VIN
VOL Output logic low ILOAD = 3 mA 400 mV
(1) Minimum (Min) and Maximum (Max) limits are specified by design, test, or statistical analysis. Typical (typ.) numbers are not verified, but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(2) All voltages are with respect to the potential at the GND pin.

6.6 Timing Requirements

MIN NOM MAX UNIT
t1 SCL clock period 2.4 µs
t2 Data in set-up time to SCL high 100 ns
t3 Data out stable After SCL low 0
t4 SDA low set-up time to SCL low (start) 100
t5 SDA high hold time after SCL high (stop) 100

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ƒSW Switching frequency 2.5 V ≤ VIN ≤ 5.5 V –6% 4 6% MHz
30171819.gifFigure 1. I2C-Compatible Interface Specifications

6.8 Typical Characteristics

Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = VIN, CIN = COUT = 2 × 10 µF and L = 1 µH, unless otherwise noted.
D001_SNVSA68.gif
Figure 2. LED Flash Current vs Brightness Code
D021_SNVSA68.gif
ƒSW = 2 MHz Flash
Brightness Code = 0x3F
Figure 4. LED Current vs Input Voltage
D023_SNVSA68.gif
ƒSW = 2 MHz Flash
Brightness Code = 0x2B
Figure 6. LED Current vs Input Voltage
D026_SNVSA68.gif
ƒSW = 4 MHz Torch
Brightness Code = 0x7F
Figure 8. LED Current vs Input Voltage
D009_SNVS967.gif
HWEN = VIN I2C = VIN
Figure 10. Standby Current vs Input Voltage
D010_SNVS967.gif
HWEN = 1.8 V I2C = 1.8 V
Figure 12. Standby Current vs Input Voltage
D012_SNVS967.gif
ƒSW = 4 MHz Flash VLED = 4.5 V
Brightness Code = 0x3F ICL = 1.9 A
Figure 14. Inductor Current Limit vs Input Voltage
D014_SNVS967.gif
ƒSW = 4 MHz Flash VLED = 4.5 V
Brightness Code = 0x3F ICL = 2.8 A
Figure 16. Inductor Current Limit vs Input Voltage
D018_SNVS967.gif
Figure 18. 4-MHz Switching Frequency vs Input Voltage
D015_SNVSA68.gif
Figure 3. LED Torch Current vs Brightness Code
D022_SNVSA68.gif
ƒSW = 4 MHz Flash
Brightness Code = 0x3F
Figure 5. LED Current vs Input Voltage
D025_SNVSA68.gif
ƒSW = 2 MHz Torch
Brightness Code = 0x7F
Figure 7. LED Current vs Input Voltage
D007_SNVS967.gif
HWEN = 0 V I2C = 0 V
Figure 9. Shutdown Current vs Input Voltage
D008_SNVS967.gif
HWEN = 1.8 V I2C = 0 V
Figure 11. Standby Current vs Input Voltage
D011_SNVS967.gif
ƒSW = 2 MHz Flash VLED = 4.5 V
Brightness Code = 0x3F ICL = 1.9 A
Figure 13. Inductor Current Limit vs Input Voltage
D013_SNVS967.gif
ƒSW = 2 MHz Flash VLED = 4.5 V
Brightness Code = 0x3F ICL = 2.8 A
Figure 15. Inductor Current Limit vs Input Voltage
D017_SNVS967.gif
Figure 17. 2-MHz Switching Frequency vs Input Voltage