ZHCSD27 October   2014 LM3648

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flash Mode
      2. 7.3.2 Torch Mode
      3. 7.3.3 IR Mode
    4. 7.4 Device Functioning Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Power Amplifier Synchronization (TX)
      4. 7.4.4 Input Voltage Flash Monitor (IVFM)
      5. 7.4.5 Fault/Protections
        1. 7.4.5.1 Fault Operation
        2. 7.4.5.2 Flash Time-Out
        3. 7.4.5.3 Overvoltage Protection (OVP)
        4. 7.4.5.4 Current Limit
        5. 7.4.5.5 NTC Thermistor Input (Torch/Temp)
        6. 7.4.5.6 Undervoltage Lockout (UVLO)
        7. 7.4.5.7 Thermal Shutdown (TSD)
        8. 7.4.5.8 LED and/or VOUT Short Fault
    5. 7.5 Programming
      1. 7.5.1 Control Truth Table
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 I2C-Compatible Chip Address
    6. 7.6 Register Descriptions
      1. 7.6.1  Enable Register (0x01)
      2. 7.6.2  IVFM Register (0x02)
      3. 7.6.3  LED Flash Brightness Register (0x03)
      4. 7.6.4  LED Torch Brightness Register (0x05)
      5. 7.6.5  Boost Configuration Register (0x07)
      6. 7.6.6  Timing Configuration Register (0x08)
      7. 7.6.7  TEMP Register (0x09)
      8. 7.6.8  Flags1 Register (0x0A)
      9. 7.6.9  Flags2 Register (0x0B)
      10. 7.6.10 Device ID Register (0x0C)
      11. 7.6.11 Last Flash Register (0x0D)
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Inductor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档 
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DSBGA (YFF)
12 Pins
30171802.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NUMBER NAME
A1 GND G Ground
A2 IN P Input voltage connection. Connect IN to the input supply and bypass to GND with a 10-µF or larger ceramic capacitor.
A3 SDA I/O Serial data input/output in the I2C Mode on LM3648.
B1 SW P Drain Connection for Internal NMOS and Synchronous PMOS Switches.
B2 STROBE I Active high hardware flash enable. Drive STROBE high to turn on Flash pulse. Internal pulldown resistor of 300 kΩ between STROBE and GND.
B3 SCL I Serial clock input for LM3648.
C1 OUT P Step-up DC/DC CONVERTER Output. Connect a 10-µF ceramic capacitor between this terminal and GND.
C2 HWEN I Active high enable pin. High = Standby, Low = Shutdown/Reset. Internal pulldown resistor of 300 kΩ between HWEN and GND.
C3 TORCH/TEMP I/P Torch terminal input or threshold detector for NTC temperature sensing and current scale back.
D1 LED P High-side current source output for flash LED. Connect pin D1 to D3 externally.
D2 TX I Configurable dual polarity power amplifier synchronization input. Internal pulldown resistor of 300 kΩ between TX and GND.
D3 LED P High-side current source output for flash LED. Connect pin D1 to D3 externally.
(1) A: Analog Pin, G: Ground Pin, P: Power Pin, I: Digital Input Pin