SNVS002E January   1999  – October 2014 LM2662 , LM2663

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Performance Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Changing Oscillator Frequency
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Simple Negative Voltage Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Paralleling Devices
          2. 9.2.1.2.2 Cascading Devices
          3. 9.2.1.2.3 Regulating VOUT
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Positive Voltage Doubler
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Splitting VIN in Half
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage (V+ to GND, or GND to OUT) 6 V
LV (OUT − 0.3 V) (GND + 3 V)
FC, OSC, SD The least negative of (OUT − 0.3 V)
or (V+ − 6 V) to (V+ + 0.3 V)
V+ and OUT continuous output current 250
Output short-circuit duration to GND(3) 1 sec.
Power dissipation (TA = 25°C)(4) 735 mW
TJ max(4) 150 °C
Operating ambient temperature −40 85
Operating junction temperature −40 105
Lead temperature (soldering, 10 seconds) 300
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.
(4) The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA)/RθJA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range −65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V+ (supply voltage) 2.5 5.5 V
Junction temperature (TJ) –40 105 °C
Ambient temperature (TJ) –40 85

6.4 Thermal Information

THERMAL METRIC(1) LM2662 LM2663 UNIT
SOIC (D)
8 PINS
RθJA Junction-to-ambient thermal resistance 170 170 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified: V+ = 5 V, FC = Open, C1 = C2 = 47 μF.(1)
PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT
V+ Supply Voltage RL = 1k Inverter, LV = Open 3.5 5.5 V
Inverter, LV = GND 1.5 5.5
Doubler, LV = OUT 2.5 5.5
IQ Supply Current No Load FC = V+ (LM2662) 1.3 4 mA
LV = Open SD = Ground (LM2663)
FC = Open 0.3 0.8
ISD Shutdown Supply Current (LM2663) 10 μA
VSD Shutdown Pin Input Voltage (LM2663) Shutdown Mode 2  (4) V
Normal Operation 0.3
IL Output Current 200 mA
ROUT Output Resistance(5) IL = 200 mA 3.5 7 Ω
fOSC Oscillator Frequency(6) OSC = Open FC = Open 7 20 kHz
FC = V+ 55 150
fSW Switching Frequency(7) OSC = Open FC = Open 3.5 10 kHz
FC = V+ 27.5 75
IOSC OSC Input Current FC = Open ±2 μA
FC = V+ ±10
PEFF Power Efficiency RL (500) between V+ and OUT 90% 96%
IL = 200 mA to GND 86%
VOEFF Voltage Conversion Efficiency No Load 99% 99.96%
(1) In the test circuit, capacitors C1 and C2 are 47-μF, 0.2-Ω maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output voltage and efficiency.
(2) –40°C to 105°C
(3) TJ = 25°C
(4) In doubling mode, when Vout > 5 V, minimum input high for shutdown equals Vout − 3 V.
(5) Specified output resistance includes internal switch resistance and capacitor ESR.
(6) For LM2663, the oscillator frequency is 150 kHz.
(7) The output switches operate at one half of the oscillator frequency, ƒOSC = 2ƒSW.

6.6 Typical Performance Characteristics

(Circuit of Figure 14 and Figure 15)
10000337.pngFigure 1. Supply Current vs Supply Voltage
10000339.pngFigure 3. Output Source Resistance vs Supply Voltage
10000341.pngFigure 5. Output Source Resistance vs Temperature
10000345.pngFigure 7. Output Voltage vs Oscillator Frequency
10000347.pngFigure 9. Oscillator Frequency vs Supply Voltage
10000349.pngFigure 11. Oscillator Frequency vs Temperatur
10000351.pngFigure 13. Shutdown Supply Current vs Temperature (LM2663 Only)
10000338.pngFigure 2. Supply Current vs Oscillator Frequency
10000340.pngFigure 4. Output Source Resistance vs Temperature
10000343.pngFigure 6. Output Voltage Drop vs Load Current
10000346.pngFigure 8. Oscillator Frequency vs External Capacitance
10000348.pngFigure 10. Oscillator Frequency vs Supply Voltage
10000350.pngFigure 12. Oscillator Frequency vs Temperature