ZHCSIJ1E June   1999  – July 2018 LM2574 , LM2574HV

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用（固定输出电压版本）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for All Output Voltage Versions
    6. 6.6  Electrical Characteristics – 3.3-V Version
    7. 6.7  Electrical Characteristics – 5-V Version
    8. 6.8  Electrical Characteristics – 12-V Version
    9. 6.9  Electrical Characteristics – 15-V Version
    10. 6.10 Electrical Characteristics – Adjustable Version
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Delayed Start-Up
      4. 7.3.4 Adjustable Output, Low-Ripple Power Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Capacitor (CIN)
      2. 8.1.2 Inductor Selection
      3. 8.1.3 Inductor Ripple Current
      4. 8.1.4 Output Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Output Voltage Ripple and Transients
      7. 8.1.7 Feedback Connection
      8. 8.1.8 ON/OFF Input
      9. 8.1.9 Additional Applications
        1. 8.1.9.1 Inverting Regulator
        2. 8.1.9.2 Negative Boost Regulator
    2. 8.2 Typical Applications
      1. 8.2.1 Fixed Output Voltage Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection (L1)
          3. 8.2.1.2.3 Output Capacitor Selection (COUT)
          4. 8.2.1.2.4 Catch Diode Selection (D1)
          5. 8.2.1.2.5 Input Capacitor (CIN)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Adjustable Output Voltage Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Programming Output Voltage
          2. 8.2.2.2.2 Inductor Selection (L1)
          3. 8.2.2.2.3 Output Capacitor Selection (COUT)
          4. 8.2.2.2.4 Catch Diode Selection (D1)
          5. 8.2.2.2.5 Input Capacitor (CIN)
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Grounding
    4. 10.4 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 使用 WEBENCH® 工具创建定制设计
      3. 11.1.3 器件命名规则
        1. 11.1.3.1  降压稳压器
        2. 11.1.3.2  降压/升压稳压器
        3. 11.1.3.3  占空比 (D)
        4. 11.1.3.4  环流二极管或导流二极管
        5. 11.1.3.5  电容器等效串联电阻 (ESR)
        6. 11.1.3.6  等效串联电感 (ESL)
        7. 11.1.3.7  输出纹波电压
        8. 11.1.3.8  电容器纹波电流
        9. 11.1.3.9  待机静态电流 (ISTBY)
        10. 11.1.3.10 电感器纹波电流 (ΔiIND)
        11. 11.1.3.11 连续与非连续模式运行
        12. 11.1.3.12 电感器饱和
        13. 11.1.3.13 运算伏特微秒常数 (E × Top)
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (April 2016) to E Revision

  • Added WEBENCH 链接 Go
  • maximum supply voltage in Abs Max Ratings from "4.5" to "45" to correct typoGo

Changes from C Revision (April 2013) to D Revision

  • 添加了器件信息 表、ESD 额定值 表、特性 说明 部分、器件功能模式、应用和实施 部分、电源建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Changed RθJA value in SOIC column to 77.1 Go
  • Split test conditions row of the Electrical Characteristics table to include TJ = 25°C and TJ < 25°C MIN, TYP, and MAX valuesGo
  • Split test conditions in IL row to rearrange the MIN, TYP, and MAX values Go

Changes from B Revision (November 2004) to C Revision

  • 已将美国国家半导体产品说明书的版面布局更改为 TI 格式Go