SNVS639G December   2009  – December 2015 LM21305

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Synchronous DC-DC Switching Converter
      2. 8.3.2  Peak Current-Mode Control
      3. 8.3.3  Switching Frequency Setting and Synchronization
      4. 8.3.4  Light-Load Operation
      5. 8.3.5  Precision Enable
      6. 8.3.6  Device Enable, Soft-Start, and Pre-Bias Startup Capability
      7. 8.3.7  Peak Current Protection and Negative Current Limiting
      8. 8.3.8  PGOOD Indicator
      9. 8.3.9  Internal Bias Regulators
      10. 8.3.10 Minimum On-Time Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overvoltage and Undervoltage Handling
      2. 8.4.2 Undervoltage Lockout (UVLO)
      3. 8.4.3 Thermal Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Setting the Output Voltage
        2. 9.2.2.2  Calculating the Duty Cycle
        3. 9.2.2.3  Input Capacitors
        4. 9.2.2.4  AVIN Filter
        5. 9.2.2.5  Switching Frequency Selection
        6. 9.2.2.6  Filter Inductor
        7. 9.2.2.7  Output Capacitor
        8. 9.2.2.8  Efficiency Considerations
        9. 9.2.2.9  Load Current Derating When Duty Cycle Exceeds 50%
        10. 9.2.2.10 Control Loop Compensation
        11. 9.2.2.11 Compensation Components Selection
        12. 9.2.2.12 Plotting the Loop Gain
        13. 9.2.2.13 High Frequency Considerations
        14. 9.2.2.14 Bootstrap Capacitor
        15. 9.2.2.15 5V0 and 2V5 Capacitors
        16. 9.2.2.16 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Compact PCB Layout for EMI Reduction
      2. 11.1.2 Ground Plane and Thermal Design Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
      2. 12.2.2 PCB Layout Resources
      3. 12.2.3 Resources for Thermal PCB Design
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from F Revision (March 2013) to G Revision

  • Changed Features, Applications, and Description sections and page 1 graphicsGo
  • Added Feature Description section, ESD Ratings table, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Changed Precision Enable sectionGo