ZHCSU26A December   2023  – February 2024 ESDS552

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 接收文档更新通知
    3. 7.3 支持资源
    4. 7.4 商标
    5. 7.5 静电放电警告
    6. 7.6 术语表
  9. 8Revision History
  10. 9机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBZ|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Pin Configuration and Functions

GUID-20230826-SS0I-1NZK-DWC6-9KVGNGQGCHHH-low.svgFigure 4-1 ESDS552 DBZ Package,3-Pin SOT-23(Top View)
Table 4-1 Pin Functions for ESDS552
PIN TYPE(1) DESCRIPTION
NAME NO.
IO 1, 2 I/O Surge and ESD protected IO
GND 3 GND Ground. Connect to ground
(1) I = Input, O = Output, I/O = Input or Output, GND = ground