SLVS854E July   2008  – December 2014 DRV8809

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interface
        1. 7.3.1.1 Setup Mode/Power-Down Mode
        2. 7.3.1.2 Extended Setup Mode
        3. 7.3.1.3 Serial Interface Timing
        4. 7.3.1.4 Bipolar Current Regulated Stepper Motor Drive
        5. 7.3.1.5 Short/Open for Motor Outputs
        6. 7.3.1.6 DCDC_MODE for Parallel-Mode Control
        7. 7.3.1.7 DCDC_MODE and C_SELECT Timing Delay and Start-Up Order
        8. 7.3.1.8 In-Reset: Input for System Reset
        9. 7.3.1.9 Blanking Time Insertion Timing for DC Motor Driving
      2. 7.3.2 Motor Driver Configuration
      3. 7.3.3 Charge Pump
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With 7 V < VM and VDIN < 18 V
      2. 7.4.2 Operation With 18 V ≤ VM and VDIN ≤ 40 V
    5. 7.5 Register Maps
      1. 7.5.1 Setup Register Bit Assignment
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage for Each DC-DC Converter
        2. 8.2.2.2 Output Voltage Startup Sequence
        3. 8.2.2.3 Motor Configuration
        4. 8.2.2.4 External Rsense-Motor Current Setting for Stepping Motor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VM Supply voltage(1) 50 V
Logic input voltage range, serial I/F inputs, and reset (2) –0.3 5.5 V
Continuous total power dissipation (θJA = 20°C/W) 4 W
Continuous motor-drive output current for each H-bridge (100 ms) 3 A
Peak motor-drive output current for each H-bridge (500 ns) 8 A
Continuous DC-DC converter output current 1.5 A
Continuous DC-DC converter output current ODB, C in parallel mode 3.0 A
TJ Operating junction temperature range (1 h) 0 150 °C
Lead temperature 1.6 mm (1/16 in) from case for 10 s 260 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The negative spike less than –5 V and narrower than 50-ns duration should not cause any problem.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) -2 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) -500 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage, VM for motor control 18 27 40 V
Supply voltage for DC-DC converter (VDIN)(2) 7 27 40 V
Average output current for motor driver for each H-bridge 800 mA
DC output current for DC-DC converter 1.2 A
DC output current for DC-DC in Ch-B/C parallel mode 2.4 A
Operating ambient temperature(1) –40 50 °C
Operating junction temperature 0 120 °C
(1) If the total power is less than 4 W, then the operating ambient temperature range is -40°C to 60°C.
(2) VDIN should be connected to VM externally.

6.4 Thermal Information

THERMAL METRIC(1) DRV8809 UNIT
HTQFP
64 PINS
RθJA Junction-to-ambient thermal resistance 26.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 12.6
RθJB Junction-to-board thermal resistance 10.4
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 10.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = 0°C to 120°C, VM = 7 V to 40 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY (SLEEP) CURRENT
ISLEEP1 Supply (sleep) current 1 nSLEEP = L, DC-DC all off 4 5 mA
ISLEEP2 Supply (sleep) current 2 nSLEEP = L, VM = 8 V, Full duty cycle 7 10 mA
ISLEEP3 Supply (sleep) current 3 nSLEEP = L, VM = 40 V, Full duty cycle 8 10 mA
DIGITAL INTERFACE CIRCUIT
VIH Digital high-level input voltage Digital inputs(1) 2 5 V
IIH Digital high-level input current Digital inputs 100 μA
VIL Digital low-level input voltage Digital inputs 0.8 V
IIL Digital low-level input current Digital inputs 100 μA
Vhys Digital input hysteresis Digital inputs 0.3 0.45 0.6 V
Tdegl Digital input deglitch time In-Reset 2.5 7.5 μs
CHARGE-PUMP VCP (CP = 0.1 μF to 0.47 μF, Cbk = 0.01 μF ± 10%)
VO(CP) Output voltage ILOAD = 0 mA, VM > VthVM2 VM + 10 VM + 13 V
f(CP) Switching frequency 1.6 MHz
tstart Start-up time CStorage = 0.1 μF, VM ≥ 16 V 0.5 2 ms
INTERNAL CLOCK OSCI
fOSCi System clock frequency 5.76 6.4 7.04 MHz
VREF INPUT
VREF Reference voltage input 0.8 2.5 3.6 V
Ileak-vr Input leak current 1 μA
C_SELECT FOR DC-DC START-UP SELECTION (DCDC_MODE = L)
Vcs0 DC-DC all off 0 0.3 V
Vcs1 DC-DC all off Pull down by external 200-kΩ resistor 1.3 2 V
Vcs2 Turn on ODA then ODB
and ODC		 As pin open 3 3.3 V
C_SELECT FOR DC-DC START-UP SELECTION (DCDC_MODE = H OR OPEN, CH-B/C PARALLEL MODE)
Vcs0 DC-DC all off 0 0.3 V
Vcs1 Turn on ODB/C then ODA Pull down by external 200-kΩ resistor 1.3 2 V
Vcs2 Turn on ODA then ODB/C As pin open 3 3.6 V
THREE DC-DC CONVERTERS(2)
VDINOPE Operating supply voltage Ratio to VOUT(DC) 1.25 = VO V
ODA
ODB
ODC		 VoutA = 1.5 V – 30 V,
VoutB/C = 1.5 V – 10 V,
Programmable with external reference on FBX
× VDIN > 1.25 × Vout (largest)		 20 V ≤ VDIN < 40 V –3% VO 3%
6.5 V ≤ VDIN < 20 V –3% VO 5%
VthVM– < VDIN < 6.5 V, VO ≤ 3.3 V –3% VO 5%
VFB FBX feedback voltage For ODA/B/C 1.50 V
IO ODx ODx output current (dc) With external L and C 1.5 A
IO ODBC ODBC output current (DC)
in Ch-B/Ch-C parallel mode		 With external L and C DCDC_MODE = H 3 A
IO ODx2 Output current (dc) at low VDIN VDIN = 7 V, VO = 5 V 0.8 A
IO ODx3 Output current (dc) at low VDIN VDIN = 7 V, VO = 3.3 V 1.5 A
fOSCD Switching (chopping frequency) fOSCD = (0,0) 90 100 110 kHz
Rds(ON) FET ON resistance at 0.8 A for OD_x TJ = 25°C 0.35 Ω
TJ = 120°C 0.50
5 V-Low 5.5-V VO at VDIN = VthV_ VDIN = VthV_, VthV_ = 5-V load (dc)
= 0.5 A(4)		 4 V
VO voltage to 5.5 V –30%
VO voltage drop from VDIN 1 V
Vo_min6 VO setting without kick UVP
when VDIN = VthVM+
(VO setting at VDIN = 10 V)		 VthVM+ = 6-V load (DC) = 0.5 A(3) 6 V
THREE DC-DC CONVERTER PROTECTION
IO DD ODx Overcurrent detect for OD_x source Peak current in each ON cycle 1.8 3 A
tFILTOCP OCP filtering time By OSCi cycles 2 cycles
tODSD DC-DC shutdown filter Number of subsequent chopping cycles with OCP detection 4 chop cycles
Vovpx Overvoltage protection (OVP) Percentage of nominal Voutx detected at VFB 25% 30% 35%
Vuvpx Undervoltage protection (UVP) Percentage of nominal Voutx detected at VFB (VFB decreasing) -25% -30% -35%
tVfilter OVP/UVP filtering time 3 8 13 us
tsst Start-up time with soft start 56 ms
Vstover Start-up overshoot Ratio to VO 3%
VM SUPERVISORY
VthVM– nORT for VM low threshold VM decreasing 4.5 5 6 V
VthVM+ nORT for VM high threshold VM increasing 5.5 6 7 V
VthVMh nORT for VM detect hysteresis (VthVM+) - (VthV—) 0.5 1 V
VthVM2 For motor driver off (5) 15 V
tVM filt VM monitor filtering time For VM threshold detect 10 30 μs
THERMAL SHUTDOWN (TSD)
TTSD Thermal shutdown set points 150 170 190 °C
TEMPERATURE SENSE, PRE TSD (See Extended Setup Register Definition)
TTSD0 Temperature sense point 0 Register selectable,
Assert logic H at TH_OUT 		130 150 170 °C
TTSD1 Temperature sense point 1 Register selectable,
Assert logic H at TH_OUT		 120 140 160 °C
Tc_sens TH_OUT (analog out) temperature coefficient Specified by design 6 mV/°C
RESET/NORT: OPEN-DRAIN OUTPUTS (NORT, LOGIC_OUT, TH_OUT)
VOH High-state voltage RL = 1 kΩ to 3.3 V 3 V
VOL Low-state voltage RL = 1 kΩ to 3.3 V 0.3 V
IOL Low-state sink current VO = 0.4 V 3 mA
tr Rise time 10% to 90% 1 μs
tf Fall time 90% to 10% 50 ns
RESET/NORT DELAY: START-UP SEQUENCE
tord1 nORT delay 1 Reset deassertion from VthVM+ < VDIN for DC-DC wake up falling 300 390 ms
tord3 DC-DC turnon delay From one DC-DC wake up to following DC-DC to go soft-start sequence 1.7 ms
tord4 nORT delay 4 Reset deassertion from 2nd DC-DC wake up 120 180 ms
In-Reset
treset In-Reset assertion to nORT assertion delay In-Reset falling to nORT failing 5 10 μs
H-BRIDGE DRIVERS (OUTX+ AND OUTX–)
IOUT1(max) Peak output current 1 Less than 500-ns period 8 A
IOUT2(max) Peak output current 2 Less than 100-ms period 3 A
IOUT(max) Average continuous output current 0.8 A
Rds(ON) FET ON resistance at 0.8 A TJ = 25°C 0.55 Ω
TJ = 120°C 1
ICEX Output leakage current VOUTX = 0 V or 10 V 10 μA
IRS Sense resistor supply current nORT = Low 15 μA
IOC Motor Motor overcurrent threshold for each H-bridge(6) 3 5 A
tfilterM Motor overcurrent filter time 2.5 5 8.5 μs
fOSCM Motor oscillator frequency F_OSCM = (0,0) 720 800 880 kHz
fchop Motor chopping frequency
= fOSCM/8		 F_OSCM = (0,0) 90 100 110 kHz
STEPPER MOTOR DRIVE (PARAMETERS ARE TESTED WITHOUT MOTOR LOADING)
ISTEPMOTORAVG Average stepper motor current
for H-bridge		 VM = 40 V 800 mA
ISTEPMOTORPeak Peak stepper motor current
for H-bridge		 VM = 40 V 1.3 A
Stepper motor current limit threshold
(internal reference)(7)		 VL16 , Phase angle = 90° 100%
VL15 , Phase angle = 84° 100%
VL14 , Phase angle = 79° 98%
VL13 , Phase angle = 73° 96%
VL12 , Phase angle = 68° 92%
VL11 , Phase angle = 62° 88%
VL10 , Phase angle = 56° 83%
VL9 , Phase angle = 51° 77%
VL8 , Phase angle = 45° 71%
VL7 , Phase angle = 40° 63%
VL6 , Phase angle = 34° 56%
VL5 , Phase angle = 28° 47%
VL4 , Phase angle = 23° 38%
VL3 , Phase angle = 17° 29%
VL2 , Phase angle = 11° 20%
VL1 , Phase angle = 6° 10%
VL0 , Phase angle = 0° 0%
IOUT Output current accuracy at 100% setting(7) Excludes VREF and RSENS errors,
IOUT > 1 A(7)(8)		 –5% 5%
IswLeakage Switch (driver MOSFET) leakage current Outputs off –10 10 μA
tab Stepper motor blanking time By OSCi cycles 8 9 cycles
STEPPER AND DC MOTOR DRIVERS
tr Rise time VM = 27 V 100 300 ns
tf Fall time 20% to 80% 100 300 ns
tPDOFF Enable or strobe detection to sink or source gate off delay 50 150 400 ns
tCOD Crossover delay time, to prevent shoot through 100 600 1000 ns
tPDON Enable or strobe detection to sink or source gate on delay 750 ns
DC MOTOR DRIVERS
tblank Blanking time TBLNK = (0,0) for Min, (1,1) for Max,
fCHOP = 100 kHz		 1.6 5.65 μs
twPminp Minimum pulse duration (phase) 1 μs
twPmine Minimum pulse duration (enable) 1 μs
SERIAL INTERFACE
f(CLK) Clock frequency 1 25 MHz
twh(CLK) Minimum high-level pulse width 10 ns
twl(CLK) Minimum low-level pulse width 10 ns
tsu Setup time, data to CLK↓ 10 ns
th Hold time, CLK↓ to data 10 ns
tcs CLK↓ to STROBE↑ 10 ns
tsc STROBE↓ to CLK↑ 10 ns
tw(STRB) Minimum strobe pulse duration 20 ns
tss_min Strobe mask time from nSLEEP 1.5 4 μs
SERIAL INTERFACE: ID MONITOR FUNCTION AT LOGIC_OUT, EXTENDED SETUP MODE
tODL 0 data output delay bit 3 to bit 0
(ext-setup) = (1100)		 From strobe rise to LOGIC_OUT,
1 kΩ to external 3.3 V		 4000 ns
tODH 1 data output delay bit 3 to bit 0
(ext-setup) = (1111)		 From strobe rise to LOGIC_OUT,
1 kΩ to external 3.3 V		 4000 ns
(1) Absolute maximum rating for charge-pump circuit is 60 V.
(2) DCDC_MODE = H, Ch-B and Ch-C are in parallel driving mode.
(3) VOUT (at VDIN = VthVM+) is lower than VO setting. When VDIN is down to VthVM+, undervoltage protection (UVP) shuts down the device, in case the VO is set as VO > 7 V. Specified by design.
(4) Lower VDIN decrease gate drive and the voltage drop is increased. Specified by bench characterization only.
(5) No nORT assertion to VthVM2 detection
(6) When the overcurrent is detected, all H-bridges are shut down and assert nORT pulse (40 ms).
(7) This is not measured directly, checked by Itrip amplifier gain without motor loading
(8) This device may show current setting error when motor current is less than 1 A, due to noise filter delay at the Itrip comparator.

6.6 Typical Characteristics

D002_SLVS854.gif
Figure 3. RdsON vs Idrain
D003_SLVS854.gif
Figure 4. Tsens (Analog Out) Temperature Coefficient