ZHCSTJ0 October   2023 DLP651LE

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Revision History
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  System Mounting Interface Loads
   9. 6.9  Micromirror Array Physical Characteristics
   10. 6.10 Micromirror Array Optical Characteristics
   11. 6.11 Window Characteristics
   12. 6.12 Chipset Component Usage Specification
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
   4. 7.4 Optical Interface and System Image Quality Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
   5. 7.5 Micromirror Array Temperature Calculation
   6. 7.6 Micromirror Power Density Calculation
   7. 7.7 Window Aperture Illumination Overfill Calculation
   8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
       1. 9.2.1 Layers
       2. 9.2.2 Impedance Requirements
       3. 9.2.3 Trace Width, Spacing
11. 10Power Supply Recommendations
    1. 10.1 DMD Power Supply Power-Up Procedure
    2. 10.2 DMD Power Supply Power-Down Procedure
12. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Device Nomenclature
       2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
13. 12Mechanical, Packaging, and Orderable Information