ZHCSTJ0
October 2023
DLP651LE
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
System Mounting Interface Loads
6.9
Micromirror Array Physical Characteristics
6.10
Micromirror Array Optical Characteristics
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Optical Interface and System Image Quality Considerations
7.4.1
Numerical Aperture and Stray Light Control
7.4.2
Pupil Match
7.4.3
Illumination Overfill
7.5
Micromirror Array Temperature Calculation
7.6
Micromirror Power Density Calculation
7.7
Window Aperture Illumination Overfill Calculation
7.8
Micromirror Landed-On/Landed-Off Duty Cycle
7.8.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.8.2
Landed Duty Cycle and Useful Life of the DMD
7.8.3
Landed Duty Cycle and Operational DMD Temperature
7.8.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
9.2.1
Layers
9.2.2
Impedance Requirements
9.2.3
Trace Width, Spacing
10
Power Supply Recommendations
10.1
DMD Power Supply Power-Up Procedure
10.2
DMD Power Supply Power-Down Procedure
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.1.2
Device Markings
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FYM|149
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcstj0_oa
zhcstj0_pm
11.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。