ZHCSN33B
November 2017 – February 2023
DLP550JE
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Window Characteristics
6.9
System Mounting Interface Loads
6.10
Micromirror Array Physical Characteristics
6.11
Micromirror Array Optical Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Feature Description
7.2.1
Power Interface
7.2.2
Timing
7.3
Optical Interface and System Image Quality Considerations
7.3.1
Numerical Aperture and Stray Light Control
7.3.2
Pupil Match
7.3.3
Illumination Overfill
7.4
Micromirror Array Temperature Calculation
7.4.1
Micromirror Array Temperature Calculation
7.5
Micromirror Landed-on/Landed-Off Duty Cycle
7.5.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.5.2
Landed Duty Cycle and Useful Life of the DMD
7.5.3
Landed Duty Cycle and Operational DMD Temperature
7.5.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
9
Power Supply Recommendations
9.1
DMD Power-Up and Power-Down Procedures
10
Device and Documentation Support
10.1
Device Support
10.1.1
第三方产品免责声明
10.1.2
Device Nomenclature
10.1.3
Device Markings
10.2
支持资源
10.2.1
Related Documentation
10.3
接收文档更新通知
10.4
Trademarks
10.5
静电放电警告
10.6
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FYA|149
MCLG018B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsn33b_oa
7.2
Feature Description